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Dr. JK Kim

Associate Professor

University of North Texas

Department of Electrical Engineering

(940) 369-7027

Email: Jungkwun.Kim@unt.edu

Education

  • PhD, State University of New York at Buffalo, 2011
    Major: Electrical Engineering
    Specialization: MEMS, 3D Microlithography
    Dissertation: ADVANCED MULTIDIRECTIONAL UV LITHOGRAPHY FOR THREE DIMENSIONAL (3-D) MICRO-/NANO STRUCTURES
  • MS, State University of New York at Buffalo, 2007
    Major: Electrical Engineering

Professional Positions

    Professional

  • Associate Professor, University of North Texas. University of North Texas. (2022 - Present).
  • Assistant Professor, Kansas State University. Kansas State University. (2016 - 2022).
  • Senior Research Engineer (Research Faculty), University of Pennsylvania. University of Pennsylvania. (2013 - 2016).
  • Post-doc fellow, Georgia Institute of Technology. Georgia Institute of Technology. (2011 - 2013).

Licensures and Certifications

  • Fundamentals of Engineering, The National Council of Examiners for Engineering and Surveying (NCEES). (2009 - Present).

Professional Memberships

  • Institute of Electrical and Electronics Engineers. (2016 - Present).

Development Activities

  • Conference Attendance, The 36th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2023), IEEE, MEMS. Munich,Germany. (January 15, 2023 - January 19, 2023).
  • Workshop, Korea-US Industrial Technology Cooperation Forum, KIAT(Korea Institute for Advancement of Technology). Washington DC,United States of America. (December 8, 2022 - December 8, 2022).
  • Conference Attendance, UKC 2022 Science and Technology in the Wake of the Pandemic, Korean-American Scientists and Engineers Association (KSEA). Washington DC,United States of America. (August 17, 2022 - August 20, 2022).
  • Tutorial, Cybersecurity Awareness Training 2021-2022, UNT. Denton,TX,United States of America. (July 28, 2022 - July 28, 2022).

Teaching

Teaching Experience

    University of North Texas

  • EENG 3510 - Electronics I (Devices and Materials), 2 courses.
  • EENG 3511 - Electronics I Lab, 5 courses.
  • EENG 4010 - Topics in Electrical Engineering, 1 course.
  • EENG 5890 - Directed Study, 5 courses.
  • EENG 5940 - Advanced Topics in Electrical Engineering, 2 courses.
  • EENG 6940 - Individual Research, 5 courses.
  • EENG 6950 - Doctoral Dissertation, 1 course.

Awards and Honors

  • 2020 SLAS Technology Reviewer Excellence Award, Society for Laboratory Automation and Screening (SLAS). (January 27, 2020).

Research

Published Intellectual Contributions

    Conference Proceeding

  • Islam, S., Tan, J., Mou, T., Ray, S., Liu, H., Kim, J., Kim, A. (2024). 3D-Printable Self-powered Piezoelectric Smart Stent for Wireless Endoleaks Sensing. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Ahmed, R., Tan, J., Li, Y., Kim, A., Yoon, D., Shin, C., Kim, J. (2024). Advancing Drug Delivery with Pocket Microneedle Achieving Dual-drug Synchronization. Austin, 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tan, J., Williams, M., Mandal, S.K., Bottiglieri, A., Tharzeen, A., Sheth, R., Natarajan, B., Prakash, P., Kim, J. (2024). Development of a Multi-modal Electrochemical sneinsing (MES) Device for Real-Time Monitoring of Tumor Microenvironment Parameters in Cancer Immunotherapy. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tharzeen, A., Munikoti, S., Prakash, P., Kim, J., Natarajan, B. (2023). A General Spatiotemporal Imputation Framework for Missing Sensor Data. Santa Clara, IEEE Conference on Artificial Intelligence (CAI).
  • Tan, J., Islam, S., Li, Y., Kim, A., Kim, J. (2023). An Optimization of Perforation Design on a Piezoelectric-based Smart Stent for Blood Pressure Monitoring and Low-Frequency Vibrational Energy Harvesting. Germany,
  • Islam, S., Ahmed, S., Santiago, A.I., Domic, M., Kim, J., Song, S., Kim, A. (2022). Multifunctional 3D printed BaTiO3 Platonic Solids Package for Implantable Microdevices. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Campbell, R., Tan, J., Santiago, A., Kim, J., Kim, A. (2022). Hydrogel Actuated Microneedle (HAM) Wound Patch. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Li, Y., Tan, J., Campbell, R., Park, W., Kim, J. (2022). Ultra-Rapid Microfabrication of Hollow-well Microneedles by Diffraction Ultraviolet(UV) lithography. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Fabrication and Characterization of Hollow Microneedle array using Diffraction UV Lithography. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Tan, J.Y., Ahmed, A., Kim, J. (2021). In-house Fabrication of Solenoid Inductor and Multilayer Metal Core using 3D printing, Selective Electroless plating, Electroplating, and Pressing. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Tan, J.Y., Kim, C., Kim, S.J., Kim, J. (2021). Ku-band Frequency Selective 3D Vertical Pillar Array. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Wang, K., Kim, J. (2021). Tiltable UV-LED Lithography for 3D Microfabrication. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.

    • Journal Article

  • Islam, S., Oh, E., Chang, W., Kim, J., Song, S., Kim, A. (2023). Omni-Directional Ultrasonic Powering via Platonic Solid Receiver for mm-Scale Implantable Devices. 5 (7) 1876-1885. ACS Materials Letters.
  • Tan, J.Y., Li, Y., Chamani, F., Tharzeen, A., Prakash, P., Natarajan, B., Sheth, R.A., Park, W.M., Kim, A., Yoon, D., Kim, J. (2022). Experimental Validation of Diffraction Lithography for Fabrication of Solid Microneedles. 15 (24) 8934. https://www.mdpi.com/1996-1944/15/24/8934
  • Dhall, A., Tan, J.Y., Oh, M.J., Islam, S., Kim, J., Kim, A., Hwang, G. (2022). A dental implant-on-a-chip for 3D modeling of host–material–pathogen interactions and therapeutic testing platforms. 22 (24) 4905--4916. Lab on a Chip. http://xlink.rsc.org/?DOI=D2LC00774F
  • Lee, M., Kim, J., Oh, M., Lee, J., Rajashekar, C.B. (2022). Effects of Supplemental UV-A LEDs on the Nutritional Quality of Lettuce: Accumulation of Protein and Other Essential Nutrients. 8 (8) 680. Horticulturae. https://www.mdpi.com/2311-7524/8/8/680
  • Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2022). Development of Programmable UV-LED Microlithography System for 3D Microfabrication. 31 (1) 97-105. Journal of Microelectromechanical Systems.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Modeling, Characterization, and Fabrication of Bell-tip Microneedle Array by Diffraction and Self-Aligned Lens Effects. 119 Applied Physics Letters.
  • Tan, J.Y., Ciappesoni, M., Kim, S.J., Kim, J. (2021). Fabrication and characterization of titanium-alloy 3D printed solenoid inductors and their sensor applications. 3 (2) 1-10. Denton, Engineering Research Express. 3940 North Elm Street, E255C

Presentations Given

    Invited Talk

  • Kim, J. (Author & Presenter), Global New Industry and New Technology Seminar, Introduction to next-generation RF/THz and biomedical device development using 3D printing/microlithography technology, Korea Institute for Advancement of Technology, Online Seminar, United States of America. (2022 - 2022).

    • Poster

  • Tan, J. (Author), Lslam, S. (Author), Kim, A. (Author), Kim, J. (Author & Presenter), MEMS 2023, AN OPTIMIZATION OF PERFORATION DESIGN ON A PIEZOELECTRIC-BASED SMART STENT FOR BLOOD PRESSURE MONITORING AND LOW-FREQUENCY VIBRATIONAL ENERGY HARVESTING, Munich Germany, Germany. (2023 - 2023).

Media Contributions

    Internet

  • "Korea Town News," Korea Town News. (November 4, 2023).

Contracts, Grants, Sponsored Research

    Contract

  • Kim, J. (Principal), "Machine Learning Integrated Neuromorphic CMOS Terahertz Focal Plane Arrays," sponsored by DoD SBIR Prixarc LLC, National, $140000 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: CPS: Medium: A CPS approach to tumor immunomodulation; sensing, analysis, and control to prime tumors to immunotherapy," sponsored by NSF-Kansas State University, Federal, $117700 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Polymer based 3-D micro-machined sub-THz waveguide for CMOS integration," sponsored by NAVY SBIR; Prixarc, LLC., National, $37500 Funded. (2022 - 2022).

    • Grant - Research

  • Kim, J. (Principal), "Development of diffraction lithography driven 3D microneedle manufacturing system," sponsored by KEIT-Raphas, International, $566407 Funded. (2022 - 2025).
  • Kim, J. (Principal), Neu, J. (Co-Principal), "Development of Advanced 3D Frequency Selective Devices for Broadband Terahertz Applications," sponsored by COS+CENG, University of North Texas, $10000 Funded. (2024 - 2025).
  • Kim, J. (Principal), "Collaborative Research: Microneedle-mediated Adaptive Phototherapy (MAP) for Wound Healing," sponsored by National Science Foundation, Federal, $226049 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: Smart Stent for Post-Endovascular Aneurysm Repair Surveillance," sponsored by National Science Foundation, Federal, $117577 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEVELOPMENT OF ADVANCED UV-LED LITHOGRAPHY SYSTEMS," sponsored by KIAT-Samil Tech, International, $54750 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEV OF TILT-ROTATION UV EXPOSURE SYSTEM FOR 3D MICROLITHOGRAPY/PRINTING," sponsored by KIAT-Samil Tech, International, $9307 Funded. (2022 - 2023).

Copyrights, Patents

    Patent

  • Kim, J., UV-LED Lithography for 3D Microfabrication, WO 2022/266066 A1. Provisional, Date of Patent Application: December 22, 2022. .
  • Kim, J., Lee, K., Kim, J., Jeong, D., Light diffraction driven photopolymerization for 3D harmonic microcone fabrication, PCT/US2021/013629. Provisional, Date of Patent Application: January 15, 2021. .
  • Kim, J., Kim, J., 3D Microlithography-Printing System using Tilting and Rotational UV-LED, 10-2019-0042115. Regular, Date Patent Approved: November 30, 2020. .
  • Kim, J., Kim, , J., 3D Microlithography-Printing System using Tilting and Rotational UV-LED, US.10,503,080 B1. Regular, Date of Patent Application: May 14, 2019. Date Patent Approved: December 10, 2019. .

Service

University Service

  • Member, CENG PAC member. (2023 - Present).
  • Committee Member, Faculty Award Committee. (2023 - Present).
  • Chairperson, Faculty search committee. (2023 - 2024).
  • Faculty Advisor, Electrical Engineering Department Open House. (October 25, 2023 - October 25, 2023).
  • Faculty Advisor, Electrical Engineering Department Open House. (October 20, 2022 - October 20, 2022).

Professional Service

  • Editor, Guest Editor, MDPI, Materials. (2021 - Present).
  • Editor, Associate Editor, Springer, Micro and Nano Systems Letters. (2020 - Present).
  • Editor, Associate Editor, Frontier, Micro-/Nano-Systems for Bioengineering and Biotechnology. (2018 - Present).
  • Committee Chair, The 17th IEEE Dallas Circuits and Systems conference. Plano, TX. (October 1, 2023 - April 25, 2024).
  • Reviewer, Grant Proposal, NSF. Washington DC, (2022 - 2023).
  • Committee Chair, The 16th IEEE Dallas Circuits and Systems conference. Denton, TX. (October 1, 2022 - April 16, 2023).
  • Reviewer, Journal Article, Journal of Micromechanics and Microengineering. (2022 - 2022).