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Dr. JK Kim

Associate Professor

University of North Texas

Department of Electrical Engineering

(940) 369-7027

Email: Jungkwun.Kim@unt.edu

Education

  • PhD, State University of New York at Buffalo, 2011
    Major: Electrical Engineering
    Specialization: MEMS, 3D Microlithography
    Dissertation: ADVANCED MULTIDIRECTIONAL UV LITHOGRAPHY FOR THREE DIMENSIONAL (3-D) MICRO-/NANO STRUCTURES
  • MS, State University of New York at Buffalo, 2007
    Major: Electrical Engineering

Professional Positions

    Professional

  • Associate Professor, University of North Texas. University of North Texas. (2022 - Present).
  • Assistant Professor, Kansas State University. Kansas State University. (2016 - 2022).
  • Senior Research Engineer (Research Faculty), University of Pennsylvania. University of Pennsylvania. (2013 - 2016).
  • Post-doc fellow, Georgia Institute of Technology. Georgia Institute of Technology. (2011 - 2013).

Licensures and Certifications

  • Fundamentals of Engineering, The National Council of Examiners for Engineering and Surveying (NCEES). (2009 - Present).

Professional Memberships

  • IEEE Eta Kappa Nu. (November 2024 - Present).
  • Institute of Electrical and Electronics Engineers. (2016 - Present).

Development Activities

  • Conference Attendance, NSF Cyber-Physical Systems Principal Investigators' Meeting, NSF CPS. Nashville,TN,United States of America. (March 20, 2024 - March 21, 2024).
  • Conference Attendance, The 37th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2024)), IEEE MEMS. Autstin,TX,United States of America. (January 2024 - January 2024).
  • Conference Attendance, The 36th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2023), IEEE, MEMS. Munich,Germany. (January 15, 2023 - January 19, 2023).
  • Workshop, Korea-US Industrial Technology Cooperation Forum, KIAT(Korea Institute for Advancement of Technology). Washington DC,United States of America. (December 8, 2022 - December 8, 2022).
  • Conference Attendance, UKC 2022 Science and Technology in the Wake of the Pandemic, Korean-American Scientists and Engineers Association (KSEA). Washington DC,United States of America. (August 17, 2022 - August 20, 2022).

Teaching

Teaching Experience

    University of North Texas

  • EENG 3510 - Electronics I (Devices and Materials), 2 courses.
  • EENG 3511 - Electronics I Lab, 5 courses.
  • EENG 4010 - Topics in Electrical Engineering, 1 course.
  • EENG 5890 - Directed Study, 6 courses.
  • EENG 5940 - Advanced Topics in Electrical Engineering, 2 courses.
  • EENG 6940 - Individual Research, 6 courses.
  • EENG 6950 - Doctoral Dissertation, 2 courses.

Awards and Honors

  • 2020 SLAS Technology Reviewer Excellence Award, Society for Laboratory Automation and Screening (SLAS). (January 27, 2020).
  • Distinguished Faculty Fellow Award, College of Engineering, University of North Texas. (2024).
  • Best Paper Award, Best Paper AWARD. (April 19, 2024).
  • Best Poster Award: 1st place, IEEE Dallas Circuits and Systems Conference (DCAS). (April 19, 2024).
  • DCAS 2024 Service REcognition Award, IEEE DCAS 2024. (April 19, 2024).
  • Best Poster Award, 2nd place, IEEE DCAS 2023 Conference. (April 2023).
  • DCAS 2023 Service Recognition Award, IEEE DCAS 2023. (April 14, 2023).

Research

Published Intellectual Contributions

    Conference Proceeding

  • Pour, M.R., Tan, J.Y., Saha, R., Kim, A., Kim, J. (2024). pH-Responsive Microneedle Actuator Array for Precise Wound Healing: Design, Actuation, Light Filtering, and Evaluation. 2024 IEEE 17th Dallas Circuits and Systems Conference (DCAS). 1-4. IEEE. https://doi.org/10.1109/dcas61159.2024.10539863
  • Islam, S., Tan, J., Mou, T., Ray, S., Liu, H., Kim, J., Kim, A. (2024). 3D-Printable Self-powered Piezoelectric Smart Stent for Wireless Endoleaks Sensing. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Ahmed, R., Tan, J., Li, Y., Kim, A., Yoon, D., Shin, C., Kim, J. (2024). Advancing Drug Delivery with Pocket Microneedle Achieving Dual-drug Synchronization. Austin, 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tan, J., Williams, M., Mandal, S.K., Bottiglieri, A., Tharzeen, A., Sheth, R., Natarajan, B., Prakash, P., Kim, J. (2024). Development of a Multi-modal Electrochemical sneinsing (MES) Device for Real-Time Monitoring of Tumor Microenvironment Parameters in Cancer Immunotherapy. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tharzeen, A., Munikoti, S., Prakash, P., Kim, J., Natarajan, B. (2023). A General Spatiotemporal Imputation Framework for Missing Sensor Data. Santa Clara, IEEE Conference on Artificial Intelligence (CAI).
  • Tan, J., Islam, S., Li, Y., Kim, A., Kim, J. (2023). An Optimization of Perforation Design on a Piezoelectric-based Smart Stent for Blood Pressure Monitoring and Low-Frequency Vibrational Energy Harvesting. Germany,
  • Islam, S., Ahmed, S., Santiago, A.I., Domic, M., Kim, J., Song, S., Kim, A. (2022). Multifunctional 3D printed BaTiO3 Platonic Solids Package for Implantable Microdevices. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Campbell, R., Ying, J., Santiago, A., Kim, J., Kim, A. (2022). HYDROGEL ACTUATED MICRONEEDLE (HAM) WOUND PATCH. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 134-137. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.31
  • Campbell, R., Tan, J., Santiago, A., Kim, J., Kim, A. (2022). Hydrogel Actuated Microneedle (HAM) Wound Patch. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Islam, S., Ahmed, S., Santiago, A., Domic, M., Kim, J., Song, S., Kim, A. (2022). MULTIFUNCTIONAL 3D PRINTED BATIO3 PLATONIC SOLIDS PACKAGING FOR IMPLANTABLE MICRODEVICES. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 415-418. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.103
  • Li, Y., Ying, J., Campbell, R., Min, W., Kim, A., Kim, J. (2022). ULTRA-RAPID MICROFABRICATION OF HOLLOW-WELL MICRONEEDLES BY DIFFRACTION ULTRAVIOLET (UV) LITHOGRAPHY. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 266-269. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.63
  • Li, Y., Tan, J., Campbell, R., Park, W., Kim, J. (2022). Ultra-Rapid Microfabrication of Hollow-well Microneedles by Diffraction Ultraviolet(UV) lithography. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Fabrication and Characterization of Hollow Microneedle array using Diffraction UV Lithography. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Tan, J.Y., Ahmed, A., Kim, J. (2021). In-house Fabrication of Solenoid Inductor and Multilayer Metal Core using 3D printing, Selective Electroless plating, Electroplating, and Pressing. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Tan, J.Y., Kim, C., Kim, S.J., Kim, J. (2021). Ku-band Frequency Selective 3D Vertical Pillar Array. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Wang, K., Kim, J. (2021). Tiltable UV-LED Lithography for 3D Microfabrication. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Kim, J. (2019). UV-LED Lithography for Millimeter-Tall High-Aspect Ratio 3d Structures. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII). 100-103. IEEE. https://doi.org/10.1109/transducers.2019.8808180
  • Kim, J., Al Thuwaini, H., Almuslem, M. (2019). H-Line Transparency Analysis of Microlithography for Millimeter Scale High-Aspect Ratio SU-8 Structures. 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). 354-357. IEEE. https://doi.org/10.1109/memsys.2019.8870619
  • Kim, J. (2018). Fabrication of SU-8 Microtowers for a 100-Turn Toroid Inductor. 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 389-392. IEEE. https://doi.org/10.1109/nems.2018.8556894
  • Goh, G., Tan, J.Y., Lee, K., Kim, Y., Kim, J. (2018). Modeling and Fabrication of Timed-Development-and-Thermal-Reflow (TDTR) Process for Microlens. 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 578-581. IEEE. https://doi.org/10.1109/nems.2018.8557011
  • Kim, J., Yoon, Y., Allen, M.G. (2017). Double-side exposure UV-LED CNC lithography for fine 3D microfabrication. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 463-466. IEEE. https://doi.org/10.1109/nems.2017.8017065
  • Kim, J. (2017). Fabrication of highly-nanolaminated metal inductor core by pressing and punching. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 661-664. IEEE. https://doi.org/10.1109/nems.2017.8017108
  • Kim, J., Yoon, Y., Mier, T.C., Allen, M.G. (2015). CNC-lithography: Computer-controlled multidirectional light-motion-synchronized lithography for 3-D microfabrication. 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). 1358-1361. IEEE. https://doi.org/10.1109/transducers.2015.7181184
  • Yu, X., Kim, J., Herrault, F., Allen, M.G. (2014). Silicon-embedded toroidal inductors with magnetic cores: Design methodology and experimental validation. 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014. 763-767. IEEE. https://doi.org/10.1109/apec.2014.6803394
  • Harburg, D.V., Khan, G.R., Herrault, F., Kim, J., Levey, C.G., Sullivan, C.R. (2013). On-chip RF power inductors with nanogranular magnetic cores using prism-assisted UV-LED lithography. 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). 701-704. IEEE. https://doi.org/10.1109/transducers.2013.6626863
  • Yu, X., Kim, M., Herrault, F., Ji, C., Kim, J., Allen, M.G. (2012). Silicon-embedded 3D toroidal air-core inductor with through-wafer interconnect for on-chip integration. 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS). 325-328. IEEE. https://doi.org/10.1109/memsys.2012.6170201
  • Cheng, X., Kim, J., Kim, C., Jao, P., Senior, D.E., Yoon, Y. (2011). Corrugated substrate integrated waveguide with dual band non-Bragg resonance. 2011 IEEE MTT-S International Microwave Symposium. 1-4. IEEE. https://doi.org/10.1109/mwsym.2011.5972949
  • Kim, J., Jao, P., Kim, C., Yoon, Y. (2011). Dispense and self-planarization process on a modified surface for multiple height 3-D microfabrication. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. 1372-1375. IEEE. https://doi.org/10.1109/transducers.2011.5969525
  • Kim, J., Cheng, X., Senior, D.E., Allen, M.G., Yoon, Y. (2011). Three dimensional nanoscale fabrication and modeling of dynamic mode multidirectional UV lithography. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. 1737-1740. IEEE. https://doi.org/10.1109/transducers.2011.5969804
  • Cheng, X., Shi, J., Kim, J., Kim, C., David, E., Yoon, Y. (2011). Compact self-packaged active folded patch antenna with omni-directional radiation pattern. 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). 1041-1046. IEEE. https://doi.org/10.1109/ectc.2011.5898638
  • Kim, J., Lee, K., Jee, H., Oh, K.W., Yoon, Y. (2010). Fabrication of multiple height microstructures using UV lithography on timed-development-and-thermal-reflowed photoresist. 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS). 376-379. IEEE. https://doi.org/10.1109/memsys.2010.5442486
  • Kim, J., Cheng, X., Ahn, H., Elles, D.S., Yoon, Y. (2010). Lithographically defined integrable air-lifted bow-tie antennas. 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS). IEEE. https://doi.org/10.1109/memsys.2010.5442287
  • Kim, J., Yun, T., Jee, H., Yoon, Y.K. (2009). Adjustable Refractive Index Method for Complex Microstructures by Automated Dynamic Mode Multidirectional UV Lithography. 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems. 733-736. IEEE. https://doi.org/10.1109/memsys.2009.4805487
  • Journal Article

  • Rupom, R.H., Jung, M., Pathak, A., Park, J., Lee, E., Ju, H., Kim, Y., Chyan, O., Kim, J., Suh, D., Choi, W. (2025). Ion-Induced Phase Changes in 2D MoTe2 Films for Neuromorphic Synaptic Device Applications. ACS Nano. American Chemical Society (ACS). https://doi.org/10.1021/acsnano.4c13915
  • Kim, J. (2024). Wireless Pressure Sensing Smart Stent for Enhanced Post-Endovascular Aneurysm Repair (EVAR) Surveillance. IEEE Access. 3940 North Elm Street, E255C
  • Kim, C., Cadwell, R., Ngoma, A., Yang, Z., Ahmad, M.M., Kim, J., Kim, S.J. (2024). Surface roughness impact of 3D Ti-alloy printed WR-10 waveguide and rectangular horn antenna at W-band (75-110 GHz). Other. 12 (1) Springer Science and Business Media LLC. https://doi.org/10.1186/s40486-024-00220-2
  • Jo, S., Pearson, E., Yoon, D., Kim, J., Park, W.M. (2024). Self-Assembly of Microstructured Protein Coatings with Programmable Functionality for Fluorescent Biosensors. Other. 16 (46) 63284-63294. American Chemical Society (ACS). https://doi.org/10.1021/acsami.4c14249
  • Islam, S., Oh, E., Chang, W., Kim, J., Song, S., Kim, A. (2023). Omni-Directional Ultrasonic Powering via Platonic Solid Receiver for mm-Scale Implantable Devices. 5 (7) 1876-1885. ACS Materials Letters.
  • Tan, J.Y., Li, Y., Chamani, F., Tharzeen, A., Prakash, P., Natarajan, B., Sheth, R.A., Park, W.M., Kim, A., Yoon, D., Kim, J. (2022). Experimental Validation of Diffraction Lithography for Fabrication of Solid Microneedles. 15 (24) 8934. https://www.mdpi.com/1996-1944/15/24/8934
  • Dhall, A., Tan, J.Y., Oh, M.J., Islam, S., Kim, J., Kim, A., Hwang, G. (2022). A dental implant-on-a-chip for 3D modeling of host–material–pathogen interactions and therapeutic testing platforms. 22 (24) 4905--4916. Lab on a Chip. http://xlink.rsc.org/?DOI=D2LC00774F
  • Lee, M., Kim, J., Oh, M., Lee, J., Rajashekar, C.B. (2022). Effects of Supplemental UV-A LEDs on the Nutritional Quality of Lettuce: Accumulation of Protein and Other Essential Nutrients. 8 (8) 680. Horticulturae. https://www.mdpi.com/2311-7524/8/8/680
  • Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2022). Development of Programmable UV-LED Microlithography System for 3D Microfabrication. 31 (1) 97-105. Journal of Microelectromechanical Systems.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Modeling, Characterization, and Fabrication of Bell-tip Microneedle Array by Diffraction and Self-Aligned Lens Effects. 119 Applied Physics Letters.
  • Tan, J.Y., Ciappesoni, M., Kim, S.J., Kim, J. (2021). Fabrication and characterization of titanium-alloy 3D printed solenoid inductors and their sensor applications. 3 (2) 1-10. Denton, Engineering Research Express. 3940 North Elm Street, E255C
  • Shiba, S.F., Tan, J.Y., Kim, J. (2020). Multidirectional UV-LED lithography using an array of high-intensity UV-LEDs and tilt-rotational sample holder for 3-D microfabrication. Other. 8 (1) Springer Science and Business Media LLC. https://doi.org/10.1186/s40486-020-00107-y
  • Islam, S., Song, X., Choi, E.T., Kim, J., Liu, H., Kim, A. (2020). In Vitro Study on Smart Stent for Autonomous Post-Endovascular Aneurysm Repair Surveillance. IEEE Access. 8 96340-96346. Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/access.2020.2996506
  • Tan, J.Y., Goh, G., Kim, J. (2020). Microfabrication of Microlens by Timed-Development-and-Thermal-Reflow (TDTR) Process for Projection Lithography. Micromachines. 11 (3) 277. MDPI AG. https://doi.org/10.3390/mi11030277
  • Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2020). 3D Microlithography Using an Integrated System of 5-mm UV-LEDs with a Tilt-Rotational Sample Holder. Micromachines. 11 (2) 157. MDPI AG. https://doi.org/10.3390/mi11020157
  • Kim, Y., Kim, J.W., Kim, J., Noh, M. (2017). A novel fabrication method of Parylene-based microelectrodes utilizing inkjet printing. Sensors and Actuators B: Chemical. 238 862-870. Elsevier BV. https://doi.org/10.1016/j.snb.2016.07.122
  • Kim, J., Yoon, Y., Allen, M.G. (2016). Computer numerical control (CNC) lithography: light-motion synchronized UV-LED lithography for 3D microfabrication. Other. 26 (3) 035003. IOP Publishing. https://doi.org/10.1088/0960-1317/26/3/035003
  • Kim, J., Yoon, Y. (2015). Fabrication of three-dimensional millimeter-height structures using direct ultraviolet lithography on liquid-state photoresist for simple and fast manufacturing. Other. 14 (3) 033504. SPIE-Intl Soc Optical Eng. https://doi.org/10.1117/1.jmm.14.3.033504
  • Kim, J., Kim, C., Allen, M.G., Yoon, Y.‘. (2015). Fabrication of 3D nanostructures by multidirectional UV lithography and predictive structural modeling. Other. 25 (2) 025017. IOP Publishing. https://doi.org/10.1088/0960-1317/25/2/025017
  • Yun, H., Liu, X., Paik, T., Palanisamy, D., Kim, J., Vogel, W.D., Viescas, A.J., Chen, J., Papaefthymiou, G.C., Kikkawa, J.M., Allen, M.G., Murray, C.B. (2014). Size- and Composition-Dependent Radio Frequency Magnetic Permeability of Iron Oxide Nanocrystals. ACS Nano. 8 (12) 12323-12337. American Chemical Society (ACS). https://doi.org/10.1021/nn504711g
  • Kim, J., Herrault, F., Yu, X., Kim, M., Shafer, R.H., Allen, M.G. (2013). Microfabrication of air core power inductors with metal-encapsulated polymer vias. Other. 23 (3) 035006. IOP Publishing. https://doi.org/10.1088/0960-1317/23/3/035006
  • Lee, K., Kim, C., Kim, Y., Ahn, B., Bang, J., Kim, J., Panchapakesan, R., Yoon, Y., Kang, J.Y., Oh, K.W. (2011). Microfluidic concentration-on-demand combinatorial dilutions. Other. 11 (1) 75-86. Springer Science and Business Media LLC. https://doi.org/10.1007/s10404-011-0775-8

Presentations Given

    Invited Talk

  • Kim, J. (Author & Presenter), Global New Industry and New Technology Seminar, Introduction to next-generation RF/THz and biomedical device development using 3D printing/microlithography technology, Korea Institute for Advancement of Technology, Online Seminar, United States of America. (2022 - 2022).
  • Poster

  • Tan, J. (Author), Lslam, S. (Author), Kim, A. (Author), Kim, J. (Author & Presenter), MEMS 2023, AN OPTIMIZATION OF PERFORATION DESIGN ON A PIEZOELECTRIC-BASED SMART STENT FOR BLOOD PRESSURE MONITORING AND LOW-FREQUENCY VIBRATIONAL ENERGY HARVESTING, Munich Germany, Germany. (2023 - 2023).

Media Contributions

    Internet

  • "Korea Town News," Korea Town News. (November 4, 2023).

Contracts, Grants, Sponsored Research

    Contract

  • Kim, J. (Principal), "Machine Learning Integrated Neuromorphic CMOS Terahertz Focal Plane Arrays," sponsored by DoD SBIR Prixarc LLC, National, $140000 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: CPS: Medium: A CPS approach to tumor immunomodulation; sensing, analysis, and control to prime tumors to immunotherapy," sponsored by NSF-Kansas State University, Federal, $117700 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Polymer based 3-D micro-machined sub-THz waveguide for CMOS integration," sponsored by NAVY SBIR; Prixarc, LLC., National, $37500 Funded. (2022 - 2022).
  • Grant - Research

  • Kim, J. (Principal), "Development of diffraction lithography driven 3D microneedle manufacturing system," sponsored by KEIT-Raphas, International, $566407 Funded. (2022 - 2025).
  • Kim, J. (Principal), Neu, J. (Co-Principal), "Development of Advanced 3D Frequency Selective Devices for Broadband Terahertz Applications," sponsored by COS+CENG, University of North Texas, $10000 Funded. (2024 - 2025).
  • Kim, J. (Principal), "Collaborative Research: Microneedle-mediated Adaptive Phototherapy (MAP) for Wound Healing," sponsored by National Science Foundation, Federal, $226049 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: Smart Stent for Post-Endovascular Aneurysm Repair Surveillance," sponsored by National Science Foundation, Federal, $117577 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEVELOPMENT OF ADVANCED UV-LED LITHOGRAPHY SYSTEMS," sponsored by KIAT-Samil Tech, International, $54750 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEV OF TILT-ROTATION UV EXPOSURE SYSTEM FOR 3D MICROLITHOGRAPY/PRINTING," sponsored by KIAT-Samil Tech, International, $9307 Funded. (2022 - 2023).
  • Sponsored Research

  • Kim, J. (Co-Principal), "Planning: DCL EPSCOR: CPS Frontier: Uncovering the Complex Tumor Microenvironment - A human-in-the-loop CPS approach to next generation cancer treatment," sponsored by NSF, Federal, Funded. (2024 - 2026).

Copyrights, Patents

    Patent

  • Kim, J., Biomarker Detection and Analysis Technology, EA.045047. Regular, Date submitted to the University: January 22, 2024. .
  • Kim, J., UV-LED Lithography for 3D Microfabrication, WO 2022/266066 A1. Regular, Date of Patent Application: December 22, 2022. .
  • Kim, J., Lee, K., Kim, J., Jeong, D., Light diffraction driven photopolymerization for 3D harmonic microcone fabrication, PCT/US2021/013629. Regular, Date of Patent Application: January 15, 2021. .
  • Kim, J., Kim, J., 3D Microlithography-Printing System using Tilting and Rotational UV-LED, 10-2019-0042115. Regular, Date Patent Approved: November 30, 2020. .
  • Kim, J., Kim, , J., 3D Microlithography-Printing System using Tilting and Rotational UV-LED, US.10,503,080 B1. Regular, Date of Patent Application: May 14, 2019. Date Patent Approved: December 10, 2019. .

Service

University Service

  • Member, CENG PAC member. (2023 - Present).
  • Committee Member, Faculty Award Committee. (2023 - Present).
  • Committee Member, Faculty Senate. (2024 - 2027).
  • Committee Member, CENG Ad Hoc Safety Committee. (2024 - 2025).
  • Chairperson, Faculty Search Committee. (2024 - 2025).
  • Committee Member, Interdisciplinary & Collaboration COACHE. (2024 - 2025).
  • Committee Member, Research Misconduct committee. (2024 - 2025).
  • Chairperson, Faculty search committee. (2023 - 2024).
  • Faculty Advisor, Electrical Engineering Department Open House. (October 25, 2023 - October 25, 2023).
  • Faculty Advisor, Electrical Engineering Department Open House. (October 20, 2022 - October 20, 2022).

Professional Service

  • Editor, Guest Editor, MDPI, Materials. (2021 - Present).
  • Editor, Associate Editor, Springer, Micro and Nano Systems Letters. (2020 - Present).
  • Editor, Associate Editor, Frontier, Micro-/Nano-Systems for Bioengineering and Biotechnology. (2018 - Present).
  • Committee Chair, The 17th IEEE Dallas Circuits and Systems conference. Plano, TX. (October 1, 2023 - April 25, 2024).
  • Reviewer, Grant Proposal, NSF. Washington DC, (2022 - 2023).
  • Committee Chair, The 16th IEEE Dallas Circuits and Systems conference. Denton, TX. (October 1, 2022 - April 16, 2023).
  • Reviewer, Journal Article, Journal of Micromechanics and Microengineering. (2022 - 2022).