Dr. Jungkwun Kim
University of North Texas
Electrical Engineering
(940) 369-7027
Email:

Education

PhD, State University of New York at Buffalo, 2011.
Major: Electrical Engineering
Degree Specialization: MEMS, 3D Microlithography
Dissertation Title: ADVANCED MULTIDIRECTIONAL UV LITHOGRAPHY FOR THREE DIMENSIONAL (3-D) MICRO-/NANO STRUCTURES
MS, State University of New York at Buffalo, 2007.
Major: Electrical Engineering

Professional Positions

Professional
Associate Professor, University of North Texas. (September 2022 – Present).
Assistant Professor, Kansas State University. (August 2016 – August 2022).
Senior Research Engineer (Research Faculty), University of Pennsylvania. (September 2013 – July 2016).
Post-doc fellow, Georgia Institute of Technology. (March 2011 – August 2013).

Licensures and Certifications

Fundamentals of Engineering, The National Council of Examiners for Engineering and Surveying (NCEES). (2009 – Present).

Professional Memberships

Institute of Electrical and Electronics Engineers. (2016 – Present).

Development Activities Attended

Conference Attendance,"The 36th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2023)," IEEE, MEMS, Munich, Germany. (January 15, 2023 – January 19, 2023).

Workshop,"Korea-US Industrial Technology Cooperation Forum," KIAT(Korea Institute for Advancement of Technology), Washington DC, United States of America. (December 8, 2022 – December 8, 2022).

Conference Attendance,"UKC 2022 Science and Technology in the Wake of the Pandemic," Korean-American Scientists and Engineers Association (KSEA), Washington DC, United States of America. (August 17, 2022 – August 20, 2022).

Tutorial,"Cybersecurity Awareness Training 2021-2022," UNT, Denton, TX, United States of America. (July 28, 2022 – July 28, 2022).

Teaching

Teaching Experience

University of North Texas
EENG 3510, Electronics I (Devices and Materials), 1 course.
EENG 3511, Electronics I Lab, 3 courses.
EENG 5890, Directed Study, 4 courses.
EENG 5940, Advanced Topics in Electrical Engineering, 1 course.
EENG 6940, Individual Research, 4 courses.

Research

Published Intellectual Contributions

Conference Proceeding
Islam, S., Tan, J., Mou, T., Ray, S., Liu, H., Kim, J., Kim, . (2024). 3D-Printable Self-powered Piezoelectric Smart Stent for Wireless Endoleaks Sensing. Austin: IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
Ahmed, R., Tan, J., Li, Y., Kim, A., Yoon, D., Shin, C., Kim, J. (2024). Advancing Drug Delivery with Pocket Microneedle Achieving Dual-drug Synchronization. Austin: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
Tan, J., Williams, M., Mandal, S. K., Bottiglieri, A., Tharzeen, A., Sheth, R., Natarajan, B., Prakash, P., Kim, J. (2024). Development of a Multi-modal Electrochemical sneinsing (MES) Device for Real-Time Monitoring of Tumor Microenvironment Parameters in Cancer Immunotherapy. Austin: IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
Tharzeen, A., Munikoti, S., Prakash, P., Kim, J., Natarajan, B. (2023). A General Spatiotemporal Imputation Framework for Missing Sensor Data. Santa Clara: IEEE Conference on Artificial Intelligence (CAI).
Tan, ., Islam, S., Li, Y., Kim, A., Kim, J. (2023). An Optimization of Perforation Design on a Piezoelectric-based Smart Stent for Blood Pressure Monitoring and Low-Frequency Vibrational Energy Harvesting. Germany:.
Islam, S., Ahmed, S., Santiago, A. I., Domic, M., Kim, J., Song, S., Kim, A. (2022). Multifunctional 3D printed BaTiO3 Platonic Solids Package for Implantable Microdevices. Hilton Head island: Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
Campbell, R., Tan, J., Santiago, A., Kim, J., Kim, A. (2022). Hydrogel Actuated Microneedle (HAM) Wound Patch. Hilton Head island: Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
Li, Y., Tan, ., Campbell, R., Park, W., Kim, J. (2022). Ultra-Rapid Microfabrication of Hollow-well Microneedles by Diffraction Ultraviolet(UV) lithography. Hilton Head island: Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
Tan, J. Y., Kim, A., Kim, J. (2021). Fabrication and Characterization of Hollow Microneedle array using Diffraction UV Lithography. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
Tan, J. Y., Ahmed, A., Kim, J. (2021). In-house Fabrication of Solenoid Inductor and Multilayer Metal Core using 3D printing, Selective Electroless plating, Electroplating, and Pressing. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
Shiba, S. F., Tan, J. Y., Kim, C., Kim, S. J., Kim, J. (2021). Ku-band Frequency Selective 3D Vertical Pillar Array. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
Shiba, S. F., Wang, K., Kim, J. (2021). Tiltable UV-LED Lithography for 3D Microfabrication. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
Journal Article
Islam, S., Oh, E., Chang, W., Kim, J., Song, S., Kim, A. (2023). Omni-Directional Ultrasonic Powering via Platonic Solid Receiver for mm-Scale Implantable Devices. 5(7), 1876-1885. ACS Materials Letters.
Tan, J. Y., Li, Y., Chamani, F., Tharzeen, A., Prakash, P., Natarajan, B., Sheth, R. A., Park, W. M., Kim, A., Yoon, D., Kim, J. (2022). Experimental Validation of Diffraction Lithography for Fabrication of Solid Microneedles. 15(24), 8934. https://www.mdpi.com/1996-1944/15/24/8934
Dhall, A., Tan, J. Y., Oh, M. J., Islam, S., Kim, J., Kim, A., Hwang, G. (2022). A dental implant-on-a-chip for 3D modeling of host–material–pathogen interactions and therapeutic testing platforms. 22(24), 4905--4916. Lab on a Chip. http://xlink.rsc.org/?DOI=D2LC00774F
Lee, M., Kim, J., Oh, M., Lee, J., Rajashekar, C. B. (2022). Effects of Supplemental UV-A LEDs on the Nutritional Quality of Lettuce: Accumulation of Protein and Other Essential Nutrients. 8(8), 680. Horticulturae. https://www.mdpi.com/2311-7524/8/8/680
Shiba, S. F., Jeon, H., Kim, J., Kim, J., Kim, J. (2022). Development of Programmable UV-LED Microlithography System for 3D Microfabrication. 31(1), 97-105. Journal of Microelectromechanical Systems.
Tan, J. Y., Kim, A., Kim, J. (2021). Modeling, Characterization, and Fabrication of Bell-tip Microneedle Array by Diffraction and Self-Aligned Lens Effects. 119, . Applied Physics Letters.
Tan, J. Y., Ciappesoni, M., Kim, S. J., Kim, J. (2021). Fabrication and characterization of titanium-alloy 3D printed solenoid inductors and their sensor applications. 3(2), 1-10. Denton: Engineering Research Express. 3940 North Elm Street, E255C

Presentations Given

Invited Talk

Kim, J. (Author & Presenter), Global New Industry and New Technology Seminar, Introduction to next-generation RF/THz and biomedical device development using 3D printing/microlithography technology, Korea Institute for Advancement of Technology, Online Seminar, United States of America. (2022 – 2022).

Poster

Tan, J. (Author), Lslam, S. (Author), Kim, A. (Author), Kim, J. (Author & Presenter), MEMS 2023, AN OPTIMIZATION OF PERFORATION DESIGN ON A PIEZOELECTRIC-BASED SMART STENT FOR BLOOD PRESSURE MONITORING AND LOW-FREQUENCY VIBRATIONAL ENERGY HARVESTING, Munich Germany, Germany. (2023 – 2023).

Media Contributions

Internet
"Korea Town News," Korea Town News. (November 4, 2023).

Contracts, Grants and Sponsored Research

Contract
Kim, J. (Principal), "Machine Learning Integrated Neuromorphic CMOS Terahertz Focal Plane Arrays," Sponsored by DoD SBIR Prixarc LLC, National, $140000 Funded. (November 1, 2022 – October 31, 2024).
Kim, J. (Principal), "Collaborative Research: CPS: Medium: A CPS approach to tumor immunomodulation; sensing, analysis, and control to prime tumors to immunotherapy," Sponsored by NSF-Kansas State University, Federal, $117700 Funded. (September 1, 2022 – February 29, 2024).
Kim, J. (Principal), "Polymer based 3-D micro-machined sub-THz waveguide for CMOS integration," Sponsored by NAVY SBIR; Prixarc, LLC., National, $37500 Funded. (July 11, 2022 – June 30, 2022).
Grant - Research
Kim, J. (Principal), "Development of diffraction lithography driven 3D microneedle manufacturing system," Sponsored by KEIT-Raphas, International, $566407 Funded. (September 15, 2022 – December 31, 2025).
Kim, J. (Principal), "Collaborative Research: Microneedle-mediated Adaptive Phototherapy (MAP) for Wound Healing," Sponsored by National Science Foundation, Federal, $226049 Funded. (September 1, 2022 – August 31, 2024).
Kim, J. (Principal), "Collaborative Research: Smart Stent for Post-Endovascular Aneurysm Repair Surveillance," Sponsored by National Science Foundation, Federal, $117577 Funded. (September 1, 2022 – August 31, 2023).
Kim, J. (Principal), "DEVELOPMENT OF ADVANCED UV-LED LITHOGRAPHY SYSTEMS," Sponsored by KIAT-Samil Tech, International, $54750 Funded. (September 1, 2022 – August 31, 2023).
Kim, J. (Principal), "DEV OF TILT-ROTATION UV EXPOSURE SYSTEM FOR 3D MICROLITHOGRAPY/PRINTING," Sponsored by KIAT-Samil Tech, International, $9307 Funded. (August 1, 2022 – August 31, 2023).

Copyrights, Patents

Patent
Kim, J., "UV-LED Lithography for 3D Microfabrication," WO 2022/266066 A1. Provisional, United States, Date of Patent Application: December 22, 2022 –.
Kim, J., Lee, K., Kim, J., Jeong, D., "Light diffraction driven photopolymerization for 3D harmonic microcone fabrication," PCT/US2021/013629. Provisional, Patent Cooperation Treaty, Date of Patent Application: January 15, 2021 –.
Kim, J., Kim, J., "3D Microlithography-Printing System using Tilting and Rotational UV-LED," 10-2019-0042115. Regular, Patent Cooperation Treaty, Date Patent Approved: November 30, 2020 –.
Kim, J., Kim,, J., "3D Microlithography-Printing System using Tilting and Rotational UV-LED," US.10,503,080 B1. Regular, United States, Date of Patent Application: May 14, 2019 –. Date Patent Approved: December 10, 2019 –.

Service

University Service

Member, CENG PAC member. (2023 – Present).

Committee Member, Faculty Award Committee. (2023 – Present).

Chairperson, Faculty search committee. (2023 – 2024).

Faculty Advisor, Electrical Engineering Department Open House. (October 25, 2023 – October 25, 2023).

Faculty Advisor, Electrical Engineering Department Open House. (October 20, 2022 – October 20, 2022).

Professional Service

Editor, Guest Editor, MDPI, Materials. (2021 – Present).

Editor, Associate Editor, Springer, Micro and Nano Systems Letters. (2020 – Present).

Editor, Associate Editor, Frontier, Micro-/Nano-Systems for Bioengineering and Biotechnology. (2018 – Present).

Committee Chair, The 17th IEEE Dallas Circuits and Systems conference, Plano, TX. (October 1, 2023 – April 25, 2024).

Reviewer, Grant Proposal, NSF, Washington DC. (2022 – 2023).

Committee Chair, The 16th IEEE Dallas Circuits and Systems conference, Denton, TX. (October 1, 2022 – April 16, 2023).

Reviewer, Journal Article, Journal of Micromechanics and Microengineering. (2022 – 2022).

Awards and Honors

2020 SLAS Technology Reviewer Excellence Award, Society for Laboratory Automation and Screening (SLAS). (January 27, 2020 – Present).