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JK Kim

Title: Associate Professor

Department: Electrical Engineering

College: College of Engineering

Curriculum Vitae

Curriculum Vitae Link

Education

  • PhD, State University of New York at Buffalo, 2011
    Major: Electrical Engineering
    Specialization: MEMS, 3D Microlithography
    Dissertation: ADVANCED MULTIDIRECTIONAL UV LITHOGRAPHY FOR THREE DIMENSIONAL (3-D) MICRO-/NANO STRUCTURES
  • MS, State University of New York at Buffalo, 2007
    Major: Electrical Engineering

Current Scheduled Teaching

EENG 5940.006Advanced Topics in Electrical EngineeringSpring 2025
EENG 3511.001Electronics I LabSpring 2025
EENG 4010.006Topics in Electrical EngineeringSpring 2025
EENG 5890.018Directed StudyFall 2024
EENG 6950.022Doctoral DissertationFall 2024
EENG 3510.001Electronics I (Devices and Materials)Fall 2024 Syllabus
EENG 3511.001Electronics I LabFall 2024 Syllabus
EENG 6940.016Individual ResearchFall 2024

Previous Scheduled Teaching

EENG 3511.001Electronics I LabSummer 10W 2024 Syllabus SPOT
EENG 5940.006Advanced Topics in Electrical EngineeringSpring 2024 Syllabus SPOT
EENG 5890.016Directed StudySpring 2024
EENG 3511.001Electronics I LabSpring 2024 Syllabus SPOT
EENG 6940.805Individual ResearchSpring 2024
EENG 5890.018Directed StudyFall 2023
EENG 3510.001Electronics I (Devices and Materials)Fall 2023 Syllabus SPOT
EENG 3511.001Electronics I LabFall 2023 Syllabus SPOT
EENG 6940.016Individual ResearchFall 2023
EENG 5890.016Directed StudySpring 2023
EENG 6940.805Individual ResearchSpring 2023
EENG 5890.018Directed StudyFall 2022
EENG 6940.016Individual ResearchFall 2022

Published Intellectual Contributions

    Conference Proceeding

  • Islam, S., Tan, J., Mou, T., Ray, S., Liu, H., Kim, J., Kim, A. (2024). 3D-Printable Self-powered Piezoelectric Smart Stent for Wireless Endoleaks Sensing. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Ahmed, R., Tan, J., Li, Y., Kim, A., Yoon, D., Shin, C., Kim, J. (2024). Advancing Drug Delivery with Pocket Microneedle Achieving Dual-drug Synchronization. Austin, 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tan, J., Williams, M., Mandal, S.K., Bottiglieri, A., Tharzeen, A., Sheth, R., Natarajan, B., Prakash, P., Kim, J. (2024). Development of a Multi-modal Electrochemical sneinsing (MES) Device for Real-Time Monitoring of Tumor Microenvironment Parameters in Cancer Immunotherapy. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tharzeen, A., Munikoti, S., Prakash, P., Kim, J., Natarajan, B. (2023). A General Spatiotemporal Imputation Framework for Missing Sensor Data. Santa Clara, IEEE Conference on Artificial Intelligence (CAI).
  • Tan, J., Islam, S., Li, Y., Kim, A., Kim, J. (2023). An Optimization of Perforation Design on a Piezoelectric-based Smart Stent for Blood Pressure Monitoring and Low-Frequency Vibrational Energy Harvesting. Germany,
  • Islam, S., Ahmed, S., Santiago, A.I., Domic, M., Kim, J., Song, S., Kim, A. (2022). Multifunctional 3D printed BaTiO3 Platonic Solids Package for Implantable Microdevices. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Campbell, R., Tan, J., Santiago, A., Kim, J., Kim, A. (2022). Hydrogel Actuated Microneedle (HAM) Wound Patch. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Li, Y., Tan, J., Campbell, R., Park, W., Kim, J. (2022). Ultra-Rapid Microfabrication of Hollow-well Microneedles by Diffraction Ultraviolet(UV) lithography. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Fabrication and Characterization of Hollow Microneedle array using Diffraction UV Lithography. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Tan, J.Y., Ahmed, A., Kim, J. (2021). In-house Fabrication of Solenoid Inductor and Multilayer Metal Core using 3D printing, Selective Electroless plating, Electroplating, and Pressing. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Tan, J.Y., Kim, C., Kim, S.J., Kim, J. (2021). Ku-band Frequency Selective 3D Vertical Pillar Array. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Wang, K., Kim, J. (2021). Tiltable UV-LED Lithography for 3D Microfabrication. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Journal Article

  • Islam, S., Oh, E., Chang, W., Kim, J., Song, S., Kim, A. (2023). Omni-Directional Ultrasonic Powering via Platonic Solid Receiver for mm-Scale Implantable Devices. 5 (7) 1876-1885. ACS Materials Letters.
  • Tan, J.Y., Li, Y., Chamani, F., Tharzeen, A., Prakash, P., Natarajan, B., Sheth, R.A., Park, W.M., Kim, A., Yoon, D., Kim, J. (2022). Experimental Validation of Diffraction Lithography for Fabrication of Solid Microneedles. 15 (24) 8934. https://www.mdpi.com/1996-1944/15/24/8934
  • Dhall, A., Tan, J.Y., Oh, M.J., Islam, S., Kim, J., Kim, A., Hwang, G. (2022). A dental implant-on-a-chip for 3D modeling of host–material–pathogen interactions and therapeutic testing platforms. 22 (24) 4905--4916. Lab on a Chip. http://xlink.rsc.org/?DOI=D2LC00774F
  • Lee, M., Kim, J., Oh, M., Lee, J., Rajashekar, C.B. (2022). Effects of Supplemental UV-A LEDs on the Nutritional Quality of Lettuce: Accumulation of Protein and Other Essential Nutrients. 8 (8) 680. Horticulturae. https://www.mdpi.com/2311-7524/8/8/680
  • Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2022). Development of Programmable UV-LED Microlithography System for 3D Microfabrication. 31 (1) 97-105. Journal of Microelectromechanical Systems.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Modeling, Characterization, and Fabrication of Bell-tip Microneedle Array by Diffraction and Self-Aligned Lens Effects. 119 Applied Physics Letters.
  • Tan, J.Y., Ciappesoni, M., Kim, S.J., Kim, J. (2021). Fabrication and characterization of titanium-alloy 3D printed solenoid inductors and their sensor applications. 3 (2) 1-10. Denton, Engineering Research Express. 3940 North Elm Street, E255C

Contracts, Grants and Sponsored Research

    Contract

  • Kim, J. (Principal), "Machine Learning Integrated Neuromorphic CMOS Terahertz Focal Plane Arrays," sponsored by DoD SBIR Prixarc LLC, National, $140000 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: CPS: Medium: A CPS approach to tumor immunomodulation; sensing, analysis, and control to prime tumors to immunotherapy," sponsored by NSF-Kansas State University, Federal, $117700 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Polymer based 3-D micro-machined sub-THz waveguide for CMOS integration," sponsored by NAVY SBIR; Prixarc, LLC., National, $37500 Funded. (2022 - 2022).
  • Grant - Research

  • Kim, J. (Principal), "Development of diffraction lithography driven 3D microneedle manufacturing system," sponsored by KEIT-Raphas, International, $566407 Funded. (2022 - 2025).
  • Kim, J. (Principal), Neu, J. (Co-Principal), "Development of Advanced 3D Frequency Selective Devices for Broadband Terahertz Applications," sponsored by COS+CENG, University of North Texas, $10000 Funded. (2024 - 2025).
  • Kim, J. (Principal), "Collaborative Research: Microneedle-mediated Adaptive Phototherapy (MAP) for Wound Healing," sponsored by National Science Foundation, Federal, $226049 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: Smart Stent for Post-Endovascular Aneurysm Repair Surveillance," sponsored by National Science Foundation, Federal, $117577 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEVELOPMENT OF ADVANCED UV-LED LITHOGRAPHY SYSTEMS," sponsored by KIAT-Samil Tech, International, $54750 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEV OF TILT-ROTATION UV EXPOSURE SYSTEM FOR 3D MICROLITHOGRAPY/PRINTING," sponsored by KIAT-Samil Tech, International, $9307 Funded. (2022 - 2023).
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Overall
Summative Rating
Challenge and
Engagement Index
Response Rate

out of 5

out of 7
%
of
students responded
  • Overall Summative Rating (median):
    This rating represents the combined responses of students to the four global summative items and is presented to provide an overall index of the class’s quality. Overall summative statements include the following (response options include a Likert scale ranging from 5 = Excellent, 3 = Good, and 1= Very poor):
    • The course as a whole was
    • The course content was
    • The instructor’s contribution to the course was
    • The instructor’s effectiveness in teaching the subject matter was
  • Challenge and Engagement Index:
    This rating combines student responses to several SPOT items relating to how academically challenging students found the course to be and how engaged they were. Challenge and Engagement Index items include the following (response options include a Likert scale ranging from 7 = Much higher, 4 = Average, and 1 = Much lower):
    • Do you expect your grade in this course to be
    • The intellectual challenge presented was
    • The amount of effort you put into this course was
    • The amount of effort to succeed in this course was
    • Your involvement in course (doing assignments, attending classes, etc.) was
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