Faculty Profile

JK Kim

Title
Associate Professor
Department
Electrical Engineering
College
College of Engineering

    

    

      


                          

            
Curriculum Vitae

            

              Click Here to View Faculty CV
            

          

        
                          

            
Education

            



  

  


  
PhD, State University of New York at Buffalo, 2011. 
Major: Electrical Engineering
Degree Specialization: MEMS, 3D Microlithography
Dissertation Title: ADVANCED MULTIDIRECTIONAL UV LITHOGRAPHY FOR THREE DIMENSIONAL (3-D) MICRO-/NANO STRUCTURES
MS, State University of New York at Buffalo, 2007. 
Major: Electrical Engineering





          

        
                

          
Current Scheduled Teaching*


          
EENG 5940.006, Advanced Topics in Electrical Engineering, Spring 2024 Syllabus
EENG 5890.016, Directed Study, Spring 2024 
EENG 3511.001, Electronics I Lab, Spring 2024 Syllabus
EENG 6940.805, Individual Research, Spring 2024 


          
*
  Texas Education Code 51.974 (HB 2504) requires each institution of
  higher education to make available to the public, a syllabus for
  undergraduate lecture courses offered for credit by the institution.
  

        

      

    

  


    

    

      


        


          


            
Previous Scheduled Teaching*


            
                    

                    EENG 5890.018, Directed Study, Fall 2023 
                    

                    EENG 3510.001, Electronics I (Devices and Materials), Fall 2023 Syllabus SPOT
                    

                    EENG 3511.001, Electronics I Lab, Fall 2023 Syllabus SPOT
                    

                    EENG 6940.016, Individual Research, Fall 2023 
                    

                    EENG 5890.016, Directed Study, Spring 2023 
                    

                    EENG 6940.805, Individual Research, Spring 2023 
                    

                    EENG 5890.018, Directed Study, Fall 2022 
                    

                    EENG 6940.016, Individual Research, Fall 2022 

          


          
*
  Texas Education Code 51.974 (HB 2504) requires each institution of
  higher education to make available to the public, a syllabus for
  undergraduate lecture courses offered for credit by the institution.
  

        

      

    

  

  
  	

	

	  

		

		   
Published Publications



  

  
Published Intellectual Contributions


  
Conference Proceeding
Islam, S., Tan, J., Mou, T., Ray, S., Liu, H., Kim, J., Kim, .  (2024). 3D-Printable Self-powered Piezoelectric Smart Stent for Wireless Endoleaks Sensing.  Austin: IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS). 
Ahmed, R., Tan, J., Li, Y., Kim, A., Yoon, D., Shin, C., Kim, J.  (2024). Advancing Drug Delivery with Pocket Microneedle Achieving Dual-drug Synchronization.  Austin: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS). 
Tan, J., Williams, M., Mandal, S. K., Bottiglieri, A., Tharzeen, A., Sheth, R., Natarajan, B., Prakash, P., Kim, J.  (2024). Development of a Multi-modal Electrochemical sneinsing (MES) Device for Real-Time Monitoring of Tumor Microenvironment Parameters in Cancer Immunotherapy.  Austin: IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS). 
Tharzeen, A., Munikoti, S., Prakash, P., Kim, J., Natarajan, B.  (2023). A General Spatiotemporal Imputation Framework for Missing Sensor Data.  Santa Clara: IEEE Conference on Artificial Intelligence (CAI). 
Tan, ., Islam, S., Li, Y., Kim, A., Kim, J.  (2023). An Optimization of Perforation Design on a Piezoelectric-based Smart Stent for Blood Pressure Monitoring and Low-Frequency Vibrational Energy Harvesting.  Germany:. 
Islam, S., Ahmed, S., Santiago, A. I., Domic, M., Kim, J., Song, S., Kim, A.  (2022). Multifunctional 3D printed BaTiO3 Platonic Solids Package for Implantable Microdevices.  Hilton Head island: Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop. 
Campbell, R., Tan, J., Santiago, A., Kim, J., Kim, A.  (2022). Hydrogel Actuated Microneedle (HAM) Wound Patch.  Hilton Head island: Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop. 
Li, Y., Tan, ., Campbell, R., Park, W., Kim, J.  (2022). Ultra-Rapid Microfabrication of Hollow-well Microneedles by Diffraction Ultraviolet(UV) lithography.  Hilton Head island: Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop. 
Tan, J. Y., Kim, A., Kim, J.  (2021). Fabrication and Characterization of Hollow Microneedle array using Diffraction UV Lithography. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems. 
Tan, J. Y., Ahmed, A., Kim, J.  (2021). In-house Fabrication of Solenoid Inductor and Multilayer Metal Core using 3D printing, Selective Electroless plating, Electroplating, and Pressing. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems. 
Shiba, S. F., Tan, J. Y., Kim, C., Kim, S. J., Kim, J.  (2021). Ku-band Frequency Selective 3D Vertical Pillar Array. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems. 
Shiba, S. F., Wang, K., Kim, J.  (2021). Tiltable UV-LED Lithography for 3D Microfabrication. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems. 
Journal Article
Islam, S., Oh, E., Chang, W., Kim, J., Song, S., Kim, A.  (2023). Omni-Directional Ultrasonic Powering via Platonic Solid Receiver for mm-Scale Implantable Devices. 5(7), 1876-1885. ACS Materials Letters. 
Tan, J. Y., Li, Y., Chamani, F., Tharzeen, A., Prakash, P., Natarajan, B., Sheth, R. A., Park, W. M., Kim, A., Yoon, D., Kim, J.  (2022). Experimental Validation of Diffraction Lithography for Fabrication of Solid Microneedles. 15(24), 8934. https://www.mdpi.com/1996-1944/15/24/8934
Dhall, A., Tan, J. Y., Oh, M. J., Islam, S., Kim, J., Kim, A., Hwang, G.  (2022). A dental implant-on-a-chip for 3D modeling of host–material–pathogen interactions and therapeutic testing platforms. 22(24), 4905--4916. Lab on a Chip. http://xlink.rsc.org/?DOI=D2LC00774F
Lee, M., Kim, J., Oh, M., Lee, J., Rajashekar, C. B. (2022). Effects of Supplemental UV-A LEDs on the Nutritional Quality of Lettuce: Accumulation of Protein and Other Essential Nutrients. 8(8), 680. Horticulturae. https://www.mdpi.com/2311-7524/8/8/680
Shiba, S. F., Jeon, H., Kim, J., Kim, J., Kim, J.  (2022). Development of Programmable UV-LED Microlithography System for 3D Microfabrication. 31(1), 97-105. Journal of Microelectromechanical Systems. 
Tan, J. Y., Kim, A., Kim, J.  (2021). Modeling, Characterization, and Fabrication of Bell-tip Microneedle Array by Diffraction and Self-Aligned Lens Effects. 119, . Applied Physics Letters. 
Tan, J. Y., Ciappesoni, M., Kim, S. J., Kim, J.  (2021). Fabrication and characterization of titanium-alloy 3D printed solenoid inductors and their sensor applications. 3(2), 1-10.  Denton: Engineering Research Express. 3940 North Elm Street, E255C



	
		
		
	  

	

	

  
    
	

	

	  

		

		   
Awarded Grants



  
  
  	  
          
Contracts, Grants and Sponsored Research  

 	 
	 	 
  
Contract   
Kim, J. (Principal), "Machine Learning Integrated Neuromorphic CMOS Terahertz Focal Plane Arrays," Sponsored by DoD SBIR Prixarc LLC, National, $140000 Funded. (November 1, 2022 – October 31, 2024).
Kim, J. (Principal), "Collaborative Research: CPS: Medium: A CPS approach to tumor immunomodulation; sensing, analysis, and control to prime tumors to immunotherapy," Sponsored by NSF-Kansas State University, Federal, $117700 Funded. (September 1, 2022 – February 29, 2024).
Kim, J. (Principal), "Polymer based 3-D micro-machined sub-THz waveguide for CMOS integration," Sponsored by NAVY SBIR; Prixarc, LLC., National, $37500 Funded. (July 11, 2022 – June 30, 2022).
Grant - Research   
Kim, J. (Principal), "Development of diffraction lithography driven 3D microneedle manufacturing system," Sponsored by KEIT-Raphas, International, $566407 Funded. (September 15, 2022 – December 31, 2025).
Kim, J. (Principal), "Collaborative Research: Microneedle-mediated Adaptive Phototherapy (MAP) for Wound Healing," Sponsored by National Science Foundation, Federal, $226049 Funded. (September 1, 2022 – August 31, 2024).
Kim, J. (Principal), "Collaborative Research: Smart Stent for Post-Endovascular Aneurysm Repair Surveillance," Sponsored by National Science Foundation, Federal, $117577 Funded. (September 1, 2022 – August 31, 2023).
Kim, J. (Principal), "DEVELOPMENT OF ADVANCED UV-LED LITHOGRAPHY SYSTEMS," Sponsored by KIAT-Samil Tech, International, $54750 Funded. (September 1, 2022 – August 31, 2023).
Kim, J. (Principal), "DEV OF TILT-ROTATION UV EXPOSURE SYSTEM FOR 3D MICROLITHOGRAPY/PRINTING," Sponsored by KIAT-Samil Tech, International, $9307 Funded. (August 1, 2022 – August 31, 2023).



	
		
		
	  

	

	

	
	

  
  
  

  	

		

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					Overall
Summative Rating		
					Challenge and
Engagement Index		
					Response Rate
					
				

			
			
				

					
					
out of 5		
					
out of 7		
					%
 of 
students responded		
					
					
				

			
		


		
    
			
  • Overall Summative Rating (median):
    
			This rating represents the combined responses of students to the four global summative items and is presented to provide an overall index of the class’s quality. Overall summative statements include the following (response options include a Likert scale ranging from 5 = Excellent, 3 = Good, and 1= Very poor):
				
      
					
    • The course as a whole was
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    • The course content was
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    • The instructor’s contribution to the course was
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    • The instructor’s effectiveness in teaching the subject matter was
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  • Challenge and Engagement Index:
    
			This rating combines student responses to several SPOT items relating to how academically challenging students found the course to be and how engaged they were. Challenge and Engagement Index items include the following (response options include a Likert scale ranging from 7 = Much higher, 4 = Average, and 1 = Much lower):
				
      
					
    • Do you expect your grade in this course to be
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    • The intellectual challenge presented was
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    • The amount of effort you put into this course was
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    • The amount of effort to succeed in this course was
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    • Your involvement in course (doing assignments, attending classes, etc.) was
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