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JK Kim

Title: Associate Professor

Department: Electrical Engineering

College: College of Engineering

Curriculum Vitae

Curriculum Vitae Link

Education

  • PhD, State University of New York at Buffalo, 2011
    Major: Electrical Engineering
    Specialization: MEMS, 3D Microlithography
    Dissertation: ADVANCED MULTIDIRECTIONAL UV LITHOGRAPHY FOR THREE DIMENSIONAL (3-D) MICRO-/NANO STRUCTURES
  • MS, State University of New York at Buffalo, 2007
    Major: Electrical Engineering

Current Scheduled Teaching

EENG 5940.006Advanced Topics in Electrical EngineeringSpring 2025
EENG 5890.016Directed StudySpring 2025
EENG 6950.016Doctoral DissertationSpring 2025
EENG 3511.001Electronics I LabSpring 2025
EENG 6940.805Individual ResearchSpring 2025
EENG 4010.006Topics in Electrical EngineeringSpring 2025

Previous Scheduled Teaching

EENG 5890.018Directed StudyFall 2024
EENG 6950.022Doctoral DissertationFall 2024
EENG 3510.001Electronics I (Devices and Materials)Fall 2024 Syllabus SPOT
EENG 3511.001Electronics I LabFall 2024 Syllabus SPOT
EENG 6940.016Individual ResearchFall 2024
EENG 3511.001Electronics I LabSummer 10W 2024 Syllabus SPOT
EENG 5940.006Advanced Topics in Electrical EngineeringSpring 2024 Syllabus SPOT
EENG 5890.016Directed StudySpring 2024
EENG 3511.001Electronics I LabSpring 2024 Syllabus SPOT
EENG 6940.805Individual ResearchSpring 2024
EENG 5890.018Directed StudyFall 2023
EENG 3510.001Electronics I (Devices and Materials)Fall 2023 Syllabus SPOT
EENG 3511.001Electronics I LabFall 2023 Syllabus SPOT
EENG 6940.016Individual ResearchFall 2023
EENG 5890.016Directed StudySpring 2023
EENG 6940.805Individual ResearchSpring 2023
EENG 5890.018Directed StudyFall 2022
EENG 6940.016Individual ResearchFall 2022

Published Intellectual Contributions

    Conference Proceeding

  • Pour, M.R., Tan, J.Y., Saha, R., Kim, A., Kim, J. (2024). pH-Responsive Microneedle Actuator Array for Precise Wound Healing: Design, Actuation, Light Filtering, and Evaluation. 2024 IEEE 17th Dallas Circuits and Systems Conference (DCAS). 1-4. IEEE. https://doi.org/10.1109/dcas61159.2024.10539863
  • Islam, S., Tan, J., Mou, T., Ray, S., Liu, H., Kim, J., Kim, A. (2024). 3D-Printable Self-powered Piezoelectric Smart Stent for Wireless Endoleaks Sensing. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Ahmed, R., Tan, J., Li, Y., Kim, A., Yoon, D., Shin, C., Kim, J. (2024). Advancing Drug Delivery with Pocket Microneedle Achieving Dual-drug Synchronization. Austin, 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tan, J., Williams, M., Mandal, S.K., Bottiglieri, A., Tharzeen, A., Sheth, R., Natarajan, B., Prakash, P., Kim, J. (2024). Development of a Multi-modal Electrochemical sneinsing (MES) Device for Real-Time Monitoring of Tumor Microenvironment Parameters in Cancer Immunotherapy. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
  • Tharzeen, A., Munikoti, S., Prakash, P., Kim, J., Natarajan, B. (2023). A General Spatiotemporal Imputation Framework for Missing Sensor Data. Santa Clara, IEEE Conference on Artificial Intelligence (CAI).
  • Tan, J., Islam, S., Li, Y., Kim, A., Kim, J. (2023). An Optimization of Perforation Design on a Piezoelectric-based Smart Stent for Blood Pressure Monitoring and Low-Frequency Vibrational Energy Harvesting. Germany,
  • Islam, S., Ahmed, S., Santiago, A.I., Domic, M., Kim, J., Song, S., Kim, A. (2022). Multifunctional 3D printed BaTiO3 Platonic Solids Package for Implantable Microdevices. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Campbell, R., Ying, J., Santiago, A., Kim, J., Kim, A. (2022). HYDROGEL ACTUATED MICRONEEDLE (HAM) WOUND PATCH. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 134-137. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.31
  • Campbell, R., Tan, J., Santiago, A., Kim, J., Kim, A. (2022). Hydrogel Actuated Microneedle (HAM) Wound Patch. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Islam, S., Ahmed, S., Santiago, A., Domic, M., Kim, J., Song, S., Kim, A. (2022). MULTIFUNCTIONAL 3D PRINTED BATIO3 PLATONIC SOLIDS PACKAGING FOR IMPLANTABLE MICRODEVICES. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 415-418. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.103
  • Li, Y., Ying, J., Campbell, R., Min, W., Kim, A., Kim, J. (2022). ULTRA-RAPID MICROFABRICATION OF HOLLOW-WELL MICRONEEDLES BY DIFFRACTION ULTRAVIOLET (UV) LITHOGRAPHY. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 266-269. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.63
  • Li, Y., Tan, J., Campbell, R., Park, W., Kim, J. (2022). Ultra-Rapid Microfabrication of Hollow-well Microneedles by Diffraction Ultraviolet(UV) lithography. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Fabrication and Characterization of Hollow Microneedle array using Diffraction UV Lithography. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Tan, J.Y., Ahmed, A., Kim, J. (2021). In-house Fabrication of Solenoid Inductor and Multilayer Metal Core using 3D printing, Selective Electroless plating, Electroplating, and Pressing. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Tan, J.Y., Kim, C., Kim, S.J., Kim, J. (2021). Ku-band Frequency Selective 3D Vertical Pillar Array. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Shiba, S.F., Wang, K., Kim, J. (2021). Tiltable UV-LED Lithography for 3D Microfabrication. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
  • Kim, J. (2019). UV-LED Lithography for Millimeter-Tall High-Aspect Ratio 3d Structures. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII). 100-103. IEEE. https://doi.org/10.1109/transducers.2019.8808180
  • Kim, J., Al Thuwaini, H., Almuslem, M. (2019). H-Line Transparency Analysis of Microlithography for Millimeter Scale High-Aspect Ratio SU-8 Structures. 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). 354-357. IEEE. https://doi.org/10.1109/memsys.2019.8870619
  • Kim, J. (2018). Fabrication of SU-8 Microtowers for a 100-Turn Toroid Inductor. 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 389-392. IEEE. https://doi.org/10.1109/nems.2018.8556894
  • Goh, G., Tan, J.Y., Lee, K., Kim, Y., Kim, J. (2018). Modeling and Fabrication of Timed-Development-and-Thermal-Reflow (TDTR) Process for Microlens. 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 578-581. IEEE. https://doi.org/10.1109/nems.2018.8557011
  • Kim, J., Yoon, Y., Allen, M.G. (2017). Double-side exposure UV-LED CNC lithography for fine 3D microfabrication. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 463-466. IEEE. https://doi.org/10.1109/nems.2017.8017065
  • Kim, J. (2017). Fabrication of highly-nanolaminated metal inductor core by pressing and punching. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 661-664. IEEE. https://doi.org/10.1109/nems.2017.8017108
  • Kim, J., Yoon, Y., Mier, T.C., Allen, M.G. (2015). CNC-lithography: Computer-controlled multidirectional light-motion-synchronized lithography for 3-D microfabrication. 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). 1358-1361. IEEE. https://doi.org/10.1109/transducers.2015.7181184
  • Yu, X., Kim, J., Herrault, F., Allen, M.G. (2014). Silicon-embedded toroidal inductors with magnetic cores: Design methodology and experimental validation. 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014. 763-767. IEEE. https://doi.org/10.1109/apec.2014.6803394
  • Harburg, D.V., Khan, G.R., Herrault, F., Kim, J., Levey, C.G., Sullivan, C.R. (2013). On-chip RF power inductors with nanogranular magnetic cores using prism-assisted UV-LED lithography. 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). 701-704. IEEE. https://doi.org/10.1109/transducers.2013.6626863
  • Yu, X., Kim, M., Herrault, F., Ji, C., Kim, J., Allen, M.G. (2012). Silicon-embedded 3D toroidal air-core inductor with through-wafer interconnect for on-chip integration. 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS). 325-328. IEEE. https://doi.org/10.1109/memsys.2012.6170201
  • Cheng, X., Kim, J., Kim, C., Jao, P., Senior, D.E., Yoon, Y. (2011). Corrugated substrate integrated waveguide with dual band non-Bragg resonance. 2011 IEEE MTT-S International Microwave Symposium. 1-4. IEEE. https://doi.org/10.1109/mwsym.2011.5972949
  • Kim, J., Jao, P., Kim, C., Yoon, Y. (2011). Dispense and self-planarization process on a modified surface for multiple height 3-D microfabrication. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. 1372-1375. IEEE. https://doi.org/10.1109/transducers.2011.5969525
  • Kim, J., Cheng, X., Senior, D.E., Allen, M.G., Yoon, Y. (2011). Three dimensional nanoscale fabrication and modeling of dynamic mode multidirectional UV lithography. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. 1737-1740. IEEE. https://doi.org/10.1109/transducers.2011.5969804
  • Cheng, X., Shi, J., Kim, J., Kim, C., David, E., Yoon, Y. (2011). Compact self-packaged active folded patch antenna with omni-directional radiation pattern. 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). 1041-1046. IEEE. https://doi.org/10.1109/ectc.2011.5898638
  • Kim, J., Lee, K., Jee, H., Oh, K.W., Yoon, Y. (2010). Fabrication of multiple height microstructures using UV lithography on timed-development-and-thermal-reflowed photoresist. 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS). 376-379. IEEE. https://doi.org/10.1109/memsys.2010.5442486
  • Kim, J., Cheng, X., Ahn, H., Elles, D.S., Yoon, Y. (2010). Lithographically defined integrable air-lifted bow-tie antennas. 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS). IEEE. https://doi.org/10.1109/memsys.2010.5442287
  • Kim, J., Yun, T., Jee, H., Yoon, Y.K. (2009). Adjustable Refractive Index Method for Complex Microstructures by Automated Dynamic Mode Multidirectional UV Lithography. 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems. 733-736. IEEE. https://doi.org/10.1109/memsys.2009.4805487
  • Journal Article

  • Rupom, R.H., Jung, M., Pathak, A., Park, J., Lee, E., Ju, H., Kim, Y., Chyan, O., Kim, J., Suh, D., Choi, W. (2025). Ion-Induced Phase Changes in 2D MoTe2 Films for Neuromorphic Synaptic Device Applications. ACS Nano. American Chemical Society (ACS). https://doi.org/10.1021/acsnano.4c13915
  • Kim, C., Cadwell, R., Ngoma, A., Yang, Z., Ahmad, M.M., Kim, J., Kim, S.J. (2024). Surface roughness impact of 3D Ti-alloy printed WR-10 waveguide and rectangular horn antenna at W-band (75-110 GHz). Other. 12 (1) Springer Science and Business Media LLC. https://doi.org/10.1186/s40486-024-00220-2
  • Jo, S., Pearson, E., Yoon, D., Kim, J., Park, W.M. (2024). Self-Assembly of Microstructured Protein Coatings with Programmable Functionality for Fluorescent Biosensors. Other. 16 (46) 63284-63294. American Chemical Society (ACS). https://doi.org/10.1021/acsami.4c14249
  • Islam, S., Oh, E., Chang, W., Kim, J., Song, S., Kim, A. (2023). Omni-Directional Ultrasonic Powering via Platonic Solid Receiver for mm-Scale Implantable Devices. 5 (7) 1876-1885. ACS Materials Letters.
  • Tan, J.Y., Li, Y., Chamani, F., Tharzeen, A., Prakash, P., Natarajan, B., Sheth, R.A., Park, W.M., Kim, A., Yoon, D., Kim, J. (2022). Experimental Validation of Diffraction Lithography for Fabrication of Solid Microneedles. 15 (24) 8934. https://www.mdpi.com/1996-1944/15/24/8934
  • Dhall, A., Tan, J.Y., Oh, M.J., Islam, S., Kim, J., Kim, A., Hwang, G. (2022). A dental implant-on-a-chip for 3D modeling of host–material–pathogen interactions and therapeutic testing platforms. 22 (24) 4905--4916. Lab on a Chip. http://xlink.rsc.org/?DOI=D2LC00774F
  • Lee, M., Kim, J., Oh, M., Lee, J., Rajashekar, C.B. (2022). Effects of Supplemental UV-A LEDs on the Nutritional Quality of Lettuce: Accumulation of Protein and Other Essential Nutrients. 8 (8) 680. Horticulturae. https://www.mdpi.com/2311-7524/8/8/680
  • Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2022). Development of Programmable UV-LED Microlithography System for 3D Microfabrication. 31 (1) 97-105. Journal of Microelectromechanical Systems.
  • Tan, J.Y., Kim, A., Kim, J. (2021). Modeling, Characterization, and Fabrication of Bell-tip Microneedle Array by Diffraction and Self-Aligned Lens Effects. 119 Applied Physics Letters.
  • Tan, J.Y., Ciappesoni, M., Kim, S.J., Kim, J. (2021). Fabrication and characterization of titanium-alloy 3D printed solenoid inductors and their sensor applications. 3 (2) 1-10. Denton, Engineering Research Express. 3940 North Elm Street, E255C
  • Shiba, S.F., Tan, J.Y., Kim, J. (2020). Multidirectional UV-LED lithography using an array of high-intensity UV-LEDs and tilt-rotational sample holder for 3-D microfabrication. Other. 8 (1) Springer Science and Business Media LLC. https://doi.org/10.1186/s40486-020-00107-y
  • Islam, S., Song, X., Choi, E.T., Kim, J., Liu, H., Kim, A. (2020). In Vitro Study on Smart Stent for Autonomous Post-Endovascular Aneurysm Repair Surveillance. IEEE Access. 8 96340-96346. Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/access.2020.2996506
  • Tan, J.Y., Goh, G., Kim, J. (2020). Microfabrication of Microlens by Timed-Development-and-Thermal-Reflow (TDTR) Process for Projection Lithography. Micromachines. 11 (3) 277. MDPI AG. https://doi.org/10.3390/mi11030277
  • Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2020). 3D Microlithography Using an Integrated System of 5-mm UV-LEDs with a Tilt-Rotational Sample Holder. Micromachines. 11 (2) 157. MDPI AG. https://doi.org/10.3390/mi11020157
  • Kim, Y., Kim, J.W., Kim, J., Noh, M. (2017). A novel fabrication method of Parylene-based microelectrodes utilizing inkjet printing. Sensors and Actuators B: Chemical. 238 862-870. Elsevier BV. https://doi.org/10.1016/j.snb.2016.07.122
  • Kim, J., Yoon, Y., Allen, M.G. (2016). Computer numerical control (CNC) lithography: light-motion synchronized UV-LED lithography for 3D microfabrication. Other. 26 (3) 035003. IOP Publishing. https://doi.org/10.1088/0960-1317/26/3/035003
  • Kim, J., Yoon, Y. (2015). Fabrication of three-dimensional millimeter-height structures using direct ultraviolet lithography on liquid-state photoresist for simple and fast manufacturing. Other. 14 (3) 033504. SPIE-Intl Soc Optical Eng. https://doi.org/10.1117/1.jmm.14.3.033504
  • Kim, J., Kim, C., Allen, M.G., Yoon, Y.‘. (2015). Fabrication of 3D nanostructures by multidirectional UV lithography and predictive structural modeling. Other. 25 (2) 025017. IOP Publishing. https://doi.org/10.1088/0960-1317/25/2/025017
  • Yun, H., Liu, X., Paik, T., Palanisamy, D., Kim, J., Vogel, W.D., Viescas, A.J., Chen, J., Papaefthymiou, G.C., Kikkawa, J.M., Allen, M.G., Murray, C.B. (2014). Size- and Composition-Dependent Radio Frequency Magnetic Permeability of Iron Oxide Nanocrystals. ACS Nano. 8 (12) 12323-12337. American Chemical Society (ACS). https://doi.org/10.1021/nn504711g
  • Kim, J., Herrault, F., Yu, X., Kim, M., Shafer, R.H., Allen, M.G. (2013). Microfabrication of air core power inductors with metal-encapsulated polymer vias. Other. 23 (3) 035006. IOP Publishing. https://doi.org/10.1088/0960-1317/23/3/035006
  • Lee, K., Kim, C., Kim, Y., Ahn, B., Bang, J., Kim, J., Panchapakesan, R., Yoon, Y., Kang, J.Y., Oh, K.W. (2011). Microfluidic concentration-on-demand combinatorial dilutions. Other. 11 (1) 75-86. Springer Science and Business Media LLC. https://doi.org/10.1007/s10404-011-0775-8

Contracts, Grants and Sponsored Research

    Contract

  • Kim, J. (Principal), "Machine Learning Integrated Neuromorphic CMOS Terahertz Focal Plane Arrays," sponsored by DoD SBIR Prixarc LLC, National, $140000 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: CPS: Medium: A CPS approach to tumor immunomodulation; sensing, analysis, and control to prime tumors to immunotherapy," sponsored by NSF-Kansas State University, Federal, $117700 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Polymer based 3-D micro-machined sub-THz waveguide for CMOS integration," sponsored by NAVY SBIR; Prixarc, LLC., National, $37500 Funded. (2022 - 2022).
  • Grant - Research

  • Kim, J. (Principal), "Development of diffraction lithography driven 3D microneedle manufacturing system," sponsored by KEIT-Raphas, International, $566407 Funded. (2022 - 2025).
  • Kim, J. (Principal), Neu, J. (Co-Principal), "Development of Advanced 3D Frequency Selective Devices for Broadband Terahertz Applications," sponsored by COS+CENG, University of North Texas, $10000 Funded. (2024 - 2025).
  • Kim, J. (Principal), "Collaborative Research: Microneedle-mediated Adaptive Phototherapy (MAP) for Wound Healing," sponsored by National Science Foundation, Federal, $226049 Funded. (2022 - 2024).
  • Kim, J. (Principal), "Collaborative Research: Smart Stent for Post-Endovascular Aneurysm Repair Surveillance," sponsored by National Science Foundation, Federal, $117577 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEVELOPMENT OF ADVANCED UV-LED LITHOGRAPHY SYSTEMS," sponsored by KIAT-Samil Tech, International, $54750 Funded. (2022 - 2023).
  • Kim, J. (Principal), "DEV OF TILT-ROTATION UV EXPOSURE SYSTEM FOR 3D MICROLITHOGRAPY/PRINTING," sponsored by KIAT-Samil Tech, International, $9307 Funded. (2022 - 2023).
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Overall
Summative Rating
Challenge and
Engagement Index
Response Rate

out of 5

out of 7
%
of
students responded
  • Overall Summative Rating (median):
    This rating represents the combined responses of students to the four global summative items and is presented to provide an overall index of the class’s quality. Overall summative statements include the following (response options include a Likert scale ranging from 5 = Excellent, 3 = Good, and 1= Very poor):
    • The course as a whole was
    • The course content was
    • The instructor’s contribution to the course was
    • The instructor’s effectiveness in teaching the subject matter was
  • Challenge and Engagement Index:
    This rating combines student responses to several SPOT items relating to how academically challenging students found the course to be and how engaged they were. Challenge and Engagement Index items include the following (response options include a Likert scale ranging from 7 = Much higher, 4 = Average, and 1 = Much lower):
    • Do you expect your grade in this course to be
    • The intellectual challenge presented was
    • The amount of effort you put into this course was
    • The amount of effort to succeed in this course was
    • Your involvement in course (doing assignments, attending classes, etc.) was
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