Curriculum Vitae
Curriculum Vitae Link
Education
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PhD, State University of New York at Buffalo, 2011
Major: Electrical Engineering
Specialization: MEMS, 3D Microlithography
Dissertation: ADVANCED MULTIDIRECTIONAL UV LITHOGRAPHY FOR THREE DIMENSIONAL (3-D) MICRO-/NANO STRUCTURES
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MS, State University of New York at Buffalo, 2007
Major: Electrical Engineering
Current Scheduled Teaching
EENG 5940.006 | Advanced Topics in Electrical Engineering | Spring 2025 |
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EENG 5890.016 | Directed Study | Spring 2025 |
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EENG 6950.016 | Doctoral Dissertation | Spring 2025 |
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EENG 3511.001 | Electronics I Lab | Spring 2025 |
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EENG 6940.805 | Individual Research | Spring 2025 |
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EENG 4010.006 | Topics in Electrical Engineering | Spring 2025 |
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Texas Education Code 51.974 (HB 2504) requires each institution of higher education to make available to the public, a syllabus for undergraduate lecture courses offered for credit by the institution.
Previous Scheduled Teaching
EENG 5890.018 | Directed Study | Fall 2024 |
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EENG 6950.022 | Doctoral Dissertation | Fall 2024 |
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EENG 3510.001 | Electronics I (Devices and Materials) | Fall 2024 |
Syllabus
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SPOT
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EENG 3511.001 | Electronics I Lab | Fall 2024 |
Syllabus
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SPOT
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EENG 6940.016 | Individual Research | Fall 2024 |
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EENG 3511.001 | Electronics I Lab | Summer 10W 2024 |
Syllabus
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SPOT
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EENG 5940.006 | Advanced Topics in Electrical Engineering | Spring 2024 |
Syllabus
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SPOT
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EENG 5890.016 | Directed Study | Spring 2024 |
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EENG 3511.001 | Electronics I Lab | Spring 2024 |
Syllabus
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SPOT
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EENG 6940.805 | Individual Research | Spring 2024 |
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EENG 5890.018 | Directed Study | Fall 2023 |
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EENG 3510.001 | Electronics I (Devices and Materials) | Fall 2023 |
Syllabus
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SPOT
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EENG 3511.001 | Electronics I Lab | Fall 2023 |
Syllabus
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SPOT
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EENG 6940.016 | Individual Research | Fall 2023 |
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EENG 5890.016 | Directed Study | Spring 2023 |
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EENG 6940.805 | Individual Research | Spring 2023 |
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EENG 5890.018 | Directed Study | Fall 2022 |
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EENG 6940.016 | Individual Research | Fall 2022 |
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Texas Education Code 51.974 (HB 2504) requires each institution of higher education to make available to the public, a syllabus for undergraduate lecture courses offered for credit by the institution.
Published Intellectual Contributions
- Pour, M.R., Tan, J.Y., Saha, R., Kim, A., Kim, J. (2024). pH-Responsive Microneedle Actuator Array for Precise Wound Healing: Design, Actuation, Light Filtering, and Evaluation. 2024 IEEE 17th Dallas Circuits and Systems Conference (DCAS). 1-4. IEEE. https://doi.org/10.1109/dcas61159.2024.10539863
- Islam, S., Tan, J., Mou, T., Ray, S., Liu, H., Kim, J., Kim, A. (2024). 3D-Printable Self-powered Piezoelectric Smart Stent for Wireless Endoleaks Sensing. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
- Ahmed, R., Tan, J., Li, Y., Kim, A., Yoon, D., Shin, C., Kim, J. (2024). Advancing Drug Delivery with Pocket Microneedle Achieving Dual-drug Synchronization. Austin, 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
- Tan, J., Williams, M., Mandal, S.K., Bottiglieri, A., Tharzeen, A., Sheth, R., Natarajan, B., Prakash, P., Kim, J. (2024). Development of a Multi-modal Electrochemical sneinsing (MES) Device for Real-Time Monitoring of Tumor Microenvironment Parameters in Cancer Immunotherapy. Austin, IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS).
- Tharzeen, A., Munikoti, S., Prakash, P., Kim, J., Natarajan, B. (2023). A General Spatiotemporal Imputation Framework for Missing Sensor Data. Santa Clara, IEEE Conference on Artificial Intelligence (CAI).
- Tan, J., Islam, S., Li, Y., Kim, A., Kim, J. (2023). An Optimization of Perforation Design on a Piezoelectric-based Smart Stent for Blood Pressure Monitoring and Low-Frequency Vibrational Energy Harvesting. Germany,
- Islam, S., Ahmed, S., Santiago, A.I., Domic, M., Kim, J., Song, S., Kim, A. (2022). Multifunctional 3D printed BaTiO3 Platonic Solids Package for Implantable Microdevices. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
- Campbell, R., Ying, J., Santiago, A., Kim, J., Kim, A. (2022). HYDROGEL ACTUATED MICRONEEDLE (HAM) WOUND PATCH. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 134-137. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.31
- Campbell, R., Tan, J., Santiago, A., Kim, J., Kim, A. (2022). Hydrogel Actuated Microneedle (HAM) Wound Patch. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
- Islam, S., Ahmed, S., Santiago, A., Domic, M., Kim, J., Song, S., Kim, A. (2022). MULTIFUNCTIONAL 3D PRINTED BATIO3 PLATONIC SOLIDS PACKAGING FOR IMPLANTABLE MICRODEVICES. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 415-418. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.103
- Li, Y., Ying, J., Campbell, R., Min, W., Kim, A., Kim, J. (2022). ULTRA-RAPID MICROFABRICATION OF HOLLOW-WELL MICRONEEDLES BY DIFFRACTION ULTRAVIOLET (UV) LITHOGRAPHY. 2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest. 266-269. Transducer Research Foundation. https://doi.org/10.31438/trf.hh2022.63
- Li, Y., Tan, J., Campbell, R., Park, W., Kim, J. (2022). Ultra-Rapid Microfabrication of Hollow-well Microneedles by Diffraction Ultraviolet(UV) lithography. Hilton Head island, Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop.
- Tan, J.Y., Kim, A., Kim, J. (2021). Fabrication and Characterization of Hollow Microneedle array using Diffraction UV Lithography. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
- Tan, J.Y., Ahmed, A., Kim, J. (2021). In-house Fabrication of Solenoid Inductor and Multilayer Metal Core using 3D printing, Selective Electroless plating, Electroplating, and Pressing. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
- Shiba, S.F., Tan, J.Y., Kim, C., Kim, S.J., Kim, J. (2021). Ku-band Frequency Selective 3D Vertical Pillar Array. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
- Shiba, S.F., Wang, K., Kim, J. (2021). Tiltable UV-LED Lithography for 3D Microfabrication. The 21st International Conference on Solid-State Sensors, Actuators and Microsystems.
- Kim, J. (2019). UV-LED Lithography for Millimeter-Tall High-Aspect Ratio 3d Structures. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII). 100-103. IEEE. https://doi.org/10.1109/transducers.2019.8808180
- Kim, J., Al Thuwaini, H., Almuslem, M. (2019). H-Line Transparency Analysis of Microlithography for Millimeter Scale High-Aspect Ratio SU-8 Structures. 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). 354-357. IEEE. https://doi.org/10.1109/memsys.2019.8870619
- Kim, J. (2018). Fabrication of SU-8 Microtowers for a 100-Turn Toroid Inductor. 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 389-392. IEEE. https://doi.org/10.1109/nems.2018.8556894
- Goh, G., Tan, J.Y., Lee, K., Kim, Y., Kim, J. (2018). Modeling and Fabrication of Timed-Development-and-Thermal-Reflow (TDTR) Process for Microlens. 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 578-581. IEEE. https://doi.org/10.1109/nems.2018.8557011
- Kim, J., Yoon, Y., Allen, M.G. (2017). Double-side exposure UV-LED CNC lithography for fine 3D microfabrication. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 463-466. IEEE. https://doi.org/10.1109/nems.2017.8017065
- Kim, J. (2017). Fabrication of highly-nanolaminated metal inductor core by pressing and punching. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). 661-664. IEEE. https://doi.org/10.1109/nems.2017.8017108
- Kim, J., Yoon, Y., Mier, T.C., Allen, M.G. (2015). CNC-lithography: Computer-controlled multidirectional light-motion-synchronized lithography for 3-D microfabrication. 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). 1358-1361. IEEE. https://doi.org/10.1109/transducers.2015.7181184
- Yu, X., Kim, J., Herrault, F., Allen, M.G. (2014). Silicon-embedded toroidal inductors with magnetic cores: Design methodology and experimental validation. 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014. 763-767. IEEE. https://doi.org/10.1109/apec.2014.6803394
- Harburg, D.V., Khan, G.R., Herrault, F., Kim, J., Levey, C.G., Sullivan, C.R. (2013). On-chip RF power inductors with nanogranular magnetic cores using prism-assisted UV-LED lithography. 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). 701-704. IEEE. https://doi.org/10.1109/transducers.2013.6626863
- Yu, X., Kim, M., Herrault, F., Ji, C., Kim, J., Allen, M.G. (2012). Silicon-embedded 3D toroidal air-core inductor with through-wafer interconnect for on-chip integration. 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS). 325-328. IEEE. https://doi.org/10.1109/memsys.2012.6170201
- Cheng, X., Kim, J., Kim, C., Jao, P., Senior, D.E., Yoon, Y. (2011). Corrugated substrate integrated waveguide with dual band non-Bragg resonance. 2011 IEEE MTT-S International Microwave Symposium. 1-4. IEEE. https://doi.org/10.1109/mwsym.2011.5972949
- Kim, J., Jao, P., Kim, C., Yoon, Y. (2011). Dispense and self-planarization process on a modified surface for multiple height 3-D microfabrication. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. 1372-1375. IEEE. https://doi.org/10.1109/transducers.2011.5969525
- Kim, J., Cheng, X., Senior, D.E., Allen, M.G., Yoon, Y. (2011). Three dimensional nanoscale fabrication and modeling of dynamic mode multidirectional UV lithography. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. 1737-1740. IEEE. https://doi.org/10.1109/transducers.2011.5969804
- Cheng, X., Shi, J., Kim, J., Kim, C., David, E., Yoon, Y. (2011). Compact self-packaged active folded patch antenna with omni-directional radiation pattern. 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). 1041-1046. IEEE. https://doi.org/10.1109/ectc.2011.5898638
- Kim, J., Lee, K., Jee, H., Oh, K.W., Yoon, Y. (2010). Fabrication of multiple height microstructures using UV lithography on timed-development-and-thermal-reflowed photoresist. 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS). 376-379. IEEE. https://doi.org/10.1109/memsys.2010.5442486
- Kim, J., Cheng, X., Ahn, H., Elles, D.S., Yoon, Y. (2010). Lithographically defined integrable air-lifted bow-tie antennas. 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS). IEEE. https://doi.org/10.1109/memsys.2010.5442287
- Kim, J., Yun, T., Jee, H., Yoon, Y.K. (2009). Adjustable Refractive Index Method for Complex Microstructures by Automated Dynamic Mode Multidirectional UV Lithography. 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems. 733-736. IEEE. https://doi.org/10.1109/memsys.2009.4805487
- Rupom, R.H., Jung, M., Pathak, A., Park, J., Lee, E., Ju, H., Kim, Y., Chyan, O., Kim, J., Suh, D., Choi, W. (2025). Ion-Induced Phase Changes in 2D MoTe2 Films for Neuromorphic Synaptic Device Applications. ACS Nano. American Chemical Society (ACS). https://doi.org/10.1021/acsnano.4c13915
- Kim, C., Cadwell, R., Ngoma, A., Yang, Z., Ahmad, M.M., Kim, J., Kim, S.J. (2024). Surface roughness impact of 3D Ti-alloy printed WR-10 waveguide and rectangular horn antenna at W-band (75-110 GHz). Other. 12 (1) Springer Science and Business Media LLC. https://doi.org/10.1186/s40486-024-00220-2
- Jo, S., Pearson, E., Yoon, D., Kim, J., Park, W.M. (2024). Self-Assembly of Microstructured Protein Coatings with Programmable Functionality for Fluorescent Biosensors. Other. 16 (46) 63284-63294. American Chemical Society (ACS). https://doi.org/10.1021/acsami.4c14249
- Islam, S., Oh, E., Chang, W., Kim, J., Song, S., Kim, A. (2023). Omni-Directional Ultrasonic Powering via Platonic Solid Receiver for mm-Scale Implantable Devices. 5 (7) 1876-1885. ACS Materials Letters.
- Tan, J.Y., Li, Y., Chamani, F., Tharzeen, A., Prakash, P., Natarajan, B., Sheth, R.A., Park, W.M., Kim, A., Yoon, D., Kim, J. (2022). Experimental Validation of Diffraction Lithography for Fabrication of Solid Microneedles. 15 (24) 8934. https://www.mdpi.com/1996-1944/15/24/8934
- Dhall, A., Tan, J.Y., Oh, M.J., Islam, S., Kim, J., Kim, A., Hwang, G. (2022). A dental implant-on-a-chip for 3D modeling of host–material–pathogen interactions and therapeutic testing platforms. 22 (24) 4905--4916. Lab on a Chip. http://xlink.rsc.org/?DOI=D2LC00774F
- Lee, M., Kim, J., Oh, M., Lee, J., Rajashekar, C.B. (2022). Effects of Supplemental UV-A LEDs on the Nutritional Quality of Lettuce: Accumulation of Protein and Other Essential Nutrients. 8 (8) 680. Horticulturae. https://www.mdpi.com/2311-7524/8/8/680
- Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2022). Development of Programmable UV-LED Microlithography System for 3D Microfabrication. 31 (1) 97-105. Journal of Microelectromechanical Systems.
- Tan, J.Y., Kim, A., Kim, J. (2021). Modeling, Characterization, and Fabrication of Bell-tip Microneedle Array by Diffraction and Self-Aligned Lens Effects. 119 Applied Physics Letters.
- Tan, J.Y., Ciappesoni, M., Kim, S.J., Kim, J. (2021). Fabrication and characterization of titanium-alloy 3D printed solenoid inductors and their sensor applications. 3 (2) 1-10. Denton, Engineering Research Express. 3940 North Elm Street, E255C
- Shiba, S.F., Tan, J.Y., Kim, J. (2020). Multidirectional UV-LED lithography using an array of high-intensity UV-LEDs and tilt-rotational sample holder for 3-D microfabrication. Other. 8 (1) Springer Science and Business Media LLC. https://doi.org/10.1186/s40486-020-00107-y
- Islam, S., Song, X., Choi, E.T., Kim, J., Liu, H., Kim, A. (2020). In Vitro Study on Smart Stent for Autonomous Post-Endovascular Aneurysm Repair Surveillance. IEEE Access. 8 96340-96346. Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/access.2020.2996506
- Tan, J.Y., Goh, G., Kim, J. (2020). Microfabrication of Microlens by Timed-Development-and-Thermal-Reflow (TDTR) Process for Projection Lithography. Micromachines. 11 (3) 277. MDPI AG. https://doi.org/10.3390/mi11030277
- Shiba, S.F., Jeon, H., Kim, J., Kim, J., Kim, J. (2020). 3D Microlithography Using an Integrated System of 5-mm UV-LEDs with a Tilt-Rotational Sample Holder. Micromachines. 11 (2) 157. MDPI AG. https://doi.org/10.3390/mi11020157
- Kim, Y., Kim, J.W., Kim, J., Noh, M. (2017). A novel fabrication method of Parylene-based microelectrodes utilizing inkjet printing. Sensors and Actuators B: Chemical. 238 862-870. Elsevier BV. https://doi.org/10.1016/j.snb.2016.07.122
- Kim, J., Yoon, Y., Allen, M.G. (2016). Computer numerical control (CNC) lithography: light-motion synchronized UV-LED lithography for 3D microfabrication. Other. 26 (3) 035003. IOP Publishing. https://doi.org/10.1088/0960-1317/26/3/035003
- Kim, J., Yoon, Y. (2015). Fabrication of three-dimensional millimeter-height structures using direct ultraviolet lithography on liquid-state photoresist for simple and fast manufacturing. Other. 14 (3) 033504. SPIE-Intl Soc Optical Eng. https://doi.org/10.1117/1.jmm.14.3.033504
- Kim, J., Kim, C., Allen, M.G., Yoon, Y.‘. (2015). Fabrication of 3D nanostructures by multidirectional UV lithography and predictive structural modeling. Other. 25 (2) 025017. IOP Publishing. https://doi.org/10.1088/0960-1317/25/2/025017
- Yun, H., Liu, X., Paik, T., Palanisamy, D., Kim, J., Vogel, W.D., Viescas, A.J., Chen, J., Papaefthymiou, G.C., Kikkawa, J.M., Allen, M.G., Murray, C.B. (2014). Size- and Composition-Dependent Radio Frequency Magnetic Permeability of Iron Oxide Nanocrystals. ACS Nano. 8 (12) 12323-12337. American Chemical Society (ACS). https://doi.org/10.1021/nn504711g
- Kim, J., Herrault, F., Yu, X., Kim, M., Shafer, R.H., Allen, M.G. (2013). Microfabrication of air core power inductors with metal-encapsulated polymer vias. Other. 23 (3) 035006. IOP Publishing. https://doi.org/10.1088/0960-1317/23/3/035006
- Lee, K., Kim, C., Kim, Y., Ahn, B., Bang, J., Kim, J., Panchapakesan, R., Yoon, Y., Kang, J.Y., Oh, K.W. (2011). Microfluidic concentration-on-demand combinatorial dilutions. Other. 11 (1) 75-86. Springer Science and Business Media LLC. https://doi.org/10.1007/s10404-011-0775-8
Contracts, Grants and Sponsored Research
- Kim, J. (Principal), "Machine Learning Integrated Neuromorphic CMOS Terahertz Focal Plane Arrays," sponsored by DoD SBIR Prixarc LLC, National, $140000 Funded. (2022 - 2024).
- Kim, J. (Principal), "Collaborative Research: CPS: Medium: A CPS approach to tumor immunomodulation; sensing, analysis, and control to prime tumors to immunotherapy," sponsored by NSF-Kansas State University, Federal, $117700 Funded. (2022 - 2024).
- Kim, J. (Principal), "Polymer based 3-D micro-machined sub-THz waveguide for CMOS integration," sponsored by NAVY SBIR; Prixarc, LLC., National, $37500 Funded. (2022 - 2022).
- Kim, J. (Principal), "Development of diffraction lithography driven 3D microneedle manufacturing system," sponsored by KEIT-Raphas, International, $566407 Funded. (2022 - 2025).
- Kim, J. (Principal), Neu, J. (Co-Principal), "Development of Advanced 3D Frequency Selective Devices for Broadband Terahertz Applications," sponsored by COS+CENG, University of North Texas, $10000 Funded. (2024 - 2025).
- Kim, J. (Principal), "Collaborative Research: Microneedle-mediated Adaptive Phototherapy (MAP) for Wound Healing," sponsored by National Science Foundation, Federal, $226049 Funded. (2022 - 2024).
- Kim, J. (Principal), "Collaborative Research: Smart Stent for Post-Endovascular Aneurysm Repair Surveillance," sponsored by National Science Foundation, Federal, $117577 Funded. (2022 - 2023).
- Kim, J. (Principal), "DEVELOPMENT OF ADVANCED UV-LED LITHOGRAPHY SYSTEMS," sponsored by KIAT-Samil Tech, International, $54750 Funded. (2022 - 2023).
- Kim, J. (Principal), "DEV OF TILT-ROTATION UV EXPOSURE SYSTEM FOR 3D MICROLITHOGRAPY/PRINTING," sponsored by KIAT-Samil Tech, International, $9307 Funded. (2022 - 2023).