Oliver M R. Chyan

Previous Scheduled Teaching

Published Intellectual Contributions

Abstracts and Proceedings

• Chyan, O. (2015). removed. .International Microelectronics Assembly and Packaging Society.
• Chyan, O.R., Chan, R., Arunagiri, T., Wallace, R.W., Kim, M., Hurd, T. (2004). Ruthenium-based Copper Diffusion Barrier :Studied by Electrochemistry, SIMS Depth Profiling and Sheet Resistance Measurements. Proceeding of 204th International Meeting of the Electrochemical Society.
• Chyan, O.R., Chan, R., Arunagiri, T., Zhang, Y., Hurd, T. (2003). Interfacial Characterization of Copper Thin Film on Ruthenium: a Potential Diffusion Barrier for Cu Interconnects. Proceeding of 4th AVS International Conference on Microelectronics and Interface.
• Arunagiri, T., Chen, J., Gao, J., Goodwill, P., Chyan, O.R. (2001). Deposition of Metal Nanoparticles on Diamond Surface Via a Solution Route. Proceeding for the Electrochemical Society National Meeting.

Conference Proceeding

• Chyan, O. (2022). "Cu Electrolytic Migration Defects Prevention on RDL by a Cu-selective Passivation to Enhance Reliability ". International Microelectronics Assembly and Packaging Society, IMAPS-2022 proceeding.
• Chyan, O. (2022). "Investigation of CuAl IMCs Corrosion in Chloride Environment and its Prevention Strategy". International Microelectronics Assembly and Packaging Society, IMAPS-2022 proceeding.
• Chyan, O. (2018). "Explore High Bonding Reliability of Cu Wire Bonded Devices under Extreme Halide Contaminated Environments". International Microelectronics Assembly and Packaging Society, IMAPS-2018 proceeding, 2018.
• Chyan, O.R. (2018). Novel Corrosion Prevention Treatments for Cu Wire Bonded Device to Improve Bonding Reliability. IEEE Electronic Components and Technology Conference, ECTC-2018 Proceeding, 2018.
• Chyan, O. (2018). Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects. International Microelectronics Assembly and Packaging Society, IMAPS-2018 proceeding, 2018..
• Chyan, O. (2017). Aluminum Bond Pad Corrosion in Copper Wire Bonded Assembly – Defectivity characterization and Prevention Strategy. 2017 TECHCON Proceeding, sponsored by Semiconductor Research Corporation, 2017.
• Chyan, O. (2017). Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire-bonded Device Assembly. IEEE Electronic Components and Technology Conference, ECTC-2017 Proceeding, 2017.
• Chyan, O. (2016). Aluminum Bond Pad Corrosion of Wirebond Packages. 2016 International Microelectronics Assembly and Packaging Society, iMAPS-2016 proceeding, 2016..
• Yu, K., Chyan, O.R. (2008). Developing a Rapid Screening Metrology for Cu Corrosion in CMP Relevant Chemical Environments. International Conference on Planarization/CMP Technology.
• Gorman, B.P., Mueller, D.W., Chyan, O.R., Reidy, R.F. (2006). Analytical TEM characterization of metal penetration and supercritical pore-sealing of ash-damaged porous low-k dielectrics. Advanced Metallization Conference.

Journal Article

• Alptekin, J., Antony, K., Chyan, O.R. (2023). Cu-Cu Wire-Bonding Enabled by a Cu-selective Passivation Coating to Enhance Packaging Reliability. 13 1923-1928. IEEE Transactions on Components, Packaging and Manufacturing Technology.
• Salunke , A., Alptekin , J., Chyan, O.R. (2023). Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-selective Passivation to Enhance Reliability. 20 17-26.
• Ashok Kumar , G., Alptekin, J., Caperton , J., Salunke, A.S., Chyan, O.M. (2021). Accelerated Reliability Testing of Cu-Al Bimetallic Contact by a Micropattern Corrosion Testing Platform for Wire Bond Device Application. MethodsX. 8 101320. Denton, Elsevier.
• Ashok Kumar, G., Lambert, A., Caperton, J., Asokan , M., Yi, W., Chyan, O.M. (2021). Comparative Study of Chloride and Fluoride Induced Aluminum Pad Corrosion in Wire-Bonded Device Packaging Assembly. 2 447–460. Denton, MDPI Corrosion and Materials Degradation.
• Ross, N., Asokan , M., Ashok Kumar, G., Caperton , J., Alptekin, J., Salunke , A.S., Chyan, O.M. (2020). Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments. Microelectronic Engineering. 113 113917. Amsterdam, Netherlands, Elsevier.
• Chyan, O.R. (2017). Thin-Film UV-Vis Spectroscopy as a Chemically-Sensitive Monitoring Tool for Copper Etching Bath. 51 44-48. Amsterdam, Elsevier. https://www.journals.elsevier.com/journal-of-industrial-and-engineering-chemistry/
• Chyan, O.R. (2016). Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application. 210 512-519. Amsterdam, Elsevier. https://www.journals.elsevier.com/electrochimica-acta/
• Chyan, O.R. (2015). Exploration of Chemical Bonding Transformation Mapping to Assist Low-k Dielectric Nanostructure Fabrication. ECS Transactions. 66 1-13. http://ecst.ecsdl.org/
• Chyan, O.R. (2015). UV-assisted Modification and Removal Mechanism of a Fluorocarbon Polymer Film on Low-k Dielectric Trench Structure. ACS Applied Materials & Interfaces. 7 5051-5055. http://pubs.acs.org/journal/aamick
• Chyan, Y., Chyan, O.R. (2008). Metal Electrodeposition on an Integrated Screen-Printed Electrode Assembly. Journal of Chemical Education.
• Bhattacharyya, D., Pillai, K., Chyan, O.R., Tang, L., Timmons, R.B. (2007). A New Class of Thin Film Hydrogels Produced by Plasma Polymerization. Chemistry of Materials.
• Fang, W., Chyan, O.R., Sun, C., Wu, C., Chen, C., Chen, K., Chen, L., Huang, J. (2007). Arrayed CNx NT–RuO2 nanocomposites directly grown on Ti-buffered Si substrate for supercapacitor applications. Other.
• Fang, W., Huang, J., Sun, C., Chen, L., Chyan, O.R., Chen, K., Papakonstantinou, P. (2006). Enhanced electrochemical properties of arrayed CNx nanotubes directly grown on Ti-buffered silicon substrates. Journal of Electrochemical Society.
• Arunagiri, T., Zhang, Y., Chyan, O.R., El-Bounani, M., Kim, M., Wu, C.T., Chen, K.H., Chen, L.C. (2005). A 5 nm Ruthenium Thin Film as a Directly Plate-able Copper Diffusion Barrier. Applied Physics Letters.
• Arunagiri, T., Zhang, Y., Chyan, O.R., Kim, M., Hurd, Q.T. (2005). Interfacial Diffusion Studies of Cu/(5 nm Ru)/Si Structures: Physical Vapor Deposited vs. Electrochemically Deposited Cu. Journal of Electrochemical Society.
• Nalla, P., Huang , S., Zhang, Y., Chyan, O.R., Richmond, M., El Bouanani, M. (2005). Photochemically Induced Metallization of Surface Silicon Using Dinuclear Metal Carbonyl Compounds. Anchoring of Ruthenium to a Si(111) Surface Through Covalent Ru-Si Bond Formation. Chemistry of Materials.
• Arunagiri, T., Misra, A., Chyan, O.R. (2005). Ruthenium: a Promisingly New Diffusion Barrier for Copper Interconnects for 65 and 45 nm Integrated Circuits Technology Nodes. Other.
• Arunagiri, T., Golden, T.D., Chyan, O.R. (2005). Study of Palladium Metal Particle Deposition on the Conductive Diamond Surface by XRD, XPS and Electrochemistry. Materials Chemistry and Physics.
• Sun, C., Chen, L., Su, M.C., Hong, L.S., Chyan, O.R., Hsu, C.Y., Chen, K., Chang, T., Chang, L. (2005). Ultrafine Platinum Nanoparticles Uniformly Dispersed on Arrayed CNx Nanotubes with High Electrochemical Activity. Chemistry of Materials.
• Chan, R., Arunagiri, T., Zhang, Y., Chyan, O.R., Wallace, R., Kim, M. (2004). Diffusion Studies of Copper on Ruthenium Thin Film: a Plate-able Copper Diffusion Barrier. Electrochemical and Solid-State Letters.
• Zhang , Y., Long, L., Arunagiri, T., Ojeda, O., Flores, S., Chyan, O.R., Wallace, R. (2004). Underpotential Deposition of Copper on Electrochemically Prepared Conductive Ruthenium Oxide Surface. Electrochemical and Solid-State Letters.
• Chyan, O.R., Ponnuswamy, T., Arunagiri, T. (2003). Electrodeposition of Copper Thin Film on Ruthenium: a Potential Diffusion Barrier for Cu Interconnects. Journal of Electrochemical Society.
• Cheng, C., Arunagiri, T., Chyan, O.R. (2003). Electrodeposition of Silver and Copper/Silver Multilayer on Ruthenium Substrate as a Potential New Metal Interconnects for Integrated Circuits. American Journal of Undergraduate Research.
• Ponnuswamy, T., Chyan, O.R. (2002). Preparation and Characterization of a Novel Infrared Sensor for Nickel Detection. Analytical Sciences.
• Liang, V., Chan, R., Chyan, O.R. (2002). Preparation and Characterization of Electrolessly Deposited Platinum and Palladium Nanoparticles on Pyrolyzed Photoresist Films on Silicon Substrates. American Journal of Undergraduate Research.
• Chyan, O.R., Peng, H., Brooks, B., Chan, R. (2002). Response of Ceriodaphnia Dubia to Ionic Silver: Discrepancies Among Model Predictions, Measured Concentrations and Mortality. Chemosphere.
• Ponnuswamy, T., Chen, J., Xu, F., Chyan, O.R. (2001). Monitoring Metal Ion Contamination Onset in Hydrofluoric Acid Using Silicon/Diamond and Dual Silicon Sensing Electrode Assembly. Analyst.
• Gao, J., Arunagiri, T., Chen, J., Goodwill, P., Chyan, O.R., Perez, J., Golden, D. (2000). Preparation and Characterization of Metal Nanoparticles on a Diamond Surface. Chemistry of Materials.
• Gao, J., Arunagiri, T., Chen, J., Goodwill, P., Chyan, O.R., Perez, J., Golden, D. (2000). Preparation and characterization of metal nanoparticles on a diamond surface. Chemistry of Materials. 12 (11) 3495--3500. American Chemical Society.
• Chen, J., Xu, F., Ponnuswamy, T., Chan, R., Wu, J., Prasad, A., Chyan, O.R., Sees, J.A., Hall, L.H. (2000). Qualitative and Quantitative Study of Silicon Wafer Surfaces Using ATR/FTIR Spectroscopy. Other.
• Chyan, O.R., Chen, J., Xu, F., Wu, J., Sees, J., Hall, L. (2000). Ultrapure Water Quality Monitoring by a Silicon-based Potentiometric Sensor. The Analyst.

Popular Press Article

• Bhattacharyya, D., Pillai, K., Chyan, O.R., Tang, L., Timmons, R.B. (2007). Immobilization of biomolecules on pulsed plasma polymerized poly(vinylacetic acid) thin films. ACS Polymeric Materials Science and Engineering Preprints.
• Ponnuswamy, T., Chyan, O.R. (2007). Method of Making Integrated Circuits Using Ruthenium and Its Oxides as Cu Diffusion Barrier. U.S. Patent No. 7247554.
• Chyan, O.R., Ponnuswamy, T. (2007). Method of Making Integrated Circuits Using Ruthenium and Its Oxides as Cu Diffusion Barrier. U.S. Patent No. 7247554.
• Chyan, O.R., Ponnuswamy, T. (2004). Method of Using Materials Based on Ruthenium and Iridium and Their Oxides, As a Cu Diffusion Barrier, and Integrated Circuits Incorporating Same. U.S. Pat. Appl..
• Ponnusswamy , T., Chyan, O.R. (2001). New Cu-diffusion Barrier Materials Based on Ruthenium, Iridium and Its Oxides. UNT Invention Disclosure.
• Hall, L., Sees, J., Chyan, O.R. (2000). An Apparatus and Method for Detecting Impurities in Wet Chemicals. U.S. Patent.
• Hall, L., Sees, J., Chyan, O.R. (2000). An Apparatus and Method for Detecting Impurities in Wet Chemicals. US Patent, 6,145,372.

Contracts, Grants and Sponsored Research

Contract

• D'Souza, N.A. (Principal), Chyan, O.R. (Co-Principal), "Tunable Thermal Conductivity, Dielectric Strength Biobased Molding Compounds and Die-Attach Adhesives," sponsored by Semiconductor Research Corporation, Private, $285000 Funded. (2023 - 2025).
• Chyan, O. (Principal), "Licensed Chyan’s IC packaging technology covered by US Provisional Patent # 62/511,863," sponsored by Changzhou Ruize Microelectronics Co, International, $220000 Funded. (2017 - 2022).
• Chyan, O. (Principal), "Tech Transfer Agreement on US Patent # 9366601: Licensing fee, Service Agreement and Instrumentation Purchase," sponsored by Intel, Private, $690847 Funded. (2018 - 2021).
• Chyan, O. (Principal), "Characterization of UV-radiated Post-etch Residue MIR-IR Spectroscopy," sponsored by TEL Inc., Private, $60000 Funded. (2015 - 2017).
• Chyan, O. (Principal), "Characterization UV treatments for TTCA integrated wafer BEOL polymer removal using MIR-IR Spectroscopy," sponsored by TEL Inc., Private, $60000 Funded. (2015 - 2017).
• Chyan, O. (Principal), "Characterization of Plasma Processed Patterned Wafers by MIR-IR Spectroscopy," sponsored by Intel, Private, $21420 Funded. (2016 - 2017).
• Chyan, O. (Principal), "Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire Bonded Device Assembly," sponsored by Semiconductor Research Corporation, Private, $163333 Funded. (2015 - 2017).
• Chyan, O. (Principal), "Characterization of Plasma Processed Patterned Wafers by MIR-IR Spectroscopy," sponsored by Intel, Private, $14193 Funded. (2015 - 2016).
• Chyan, O. (Principal), "Characterization of Plasma Processed Patterned Wafers by MIR-IR Spectroscopy," sponsored by Lam Research Inc., Private, $12500 Funded. (2015 - 2016).
• Chyan, O. (Principal), "Characterization of Carbon Nanotubes Coating on Wafers using MIR-IR Spectroscopy," sponsored by Nantero Company, Private, $3000 Funded. (2015 - 2016).
• Chyan, O. (Principal), "Characterization of Chemical Equilibriums of Cu Etch Bath Samples," sponsored by Intel, Private, $7200 Funded. (2015 - 2016).
• Chyan, O. (Principal), "Investigation of Al Pad Corrosion in the Cu Wire Bonded Semiconductor Device Assembly," sponsored by Semiconductor Research Corporation, Private, $85000 Funded. (2014 - 2015).
• Chyan, O. (Principal), "Study of Chemical Bonding Structure of PECVD Amorphous Silicon Micobolometer," sponsored by L3 Communication, Private, $10000 Funded. (2014 - 2015).
• Chyan, O. (Principal), "Characterization of Plasma-etched SiC wafers by MIR-IR Spectroscopy," sponsored by Lam Research Inc., Private, $6000 Funded. (2012 - 2013).
• Chyan, O. (Principal), "Characterization of Plasma-etched ULK Patterned wafers by MIR-IR Spectroscopy," sponsored by ATMI, Private, $15000 Funded. (2012 - 2013).
• Chyan, O. (Principal), "Characterization of ULK Damages wafers by MIR-IR Spectroscopy," sponsored by TEL Inc., Private, $6000 Funded. (2012 - 2013).
• Chyan, O. (Principal), "Study of Chemical Bonding Structure of PECVD Amorphous Silicon Micobolometer," sponsored by L3 Communication, Private, $35000 Funded. (2012 - 2013).
• Chyan, O. (Principal), "Electrochemical Investigation of Cu Corrosion in Cu-CMP and Post-CMP Solution Environments," sponsored by Semiconductor Research Corporation, Private, $150000 Funded. (2010 - 2013).
• Chyan, O. (Principal), "Characterization of Cu/W/Co Bimetallic Corrosion and Inhibition IC Cleaning Solution Environments," sponsored by ATMI, Private, $48000 Funded. (2011 - 2012).
• Chyan, O. (Principal), "Characterization of Cu/W/Co Bimetallic Corrosion and Inhibition IC Cleaning Solution Environments," sponsored by ATMI, Private, $48000 Funded. (2011 - 2012).
• Chyan, O. (Principal), "Characterization of Plasma-etch-polymers using MIR-IR Spectroscopy," sponsored by Semiconductor Research Corporation, Private, $135000 Funded. (2011 - 2012).
• Chyan, O. (Principal), "Interfacial Study of Cu Bimetallic Corrosion and Inhibition IC Cleaning Solution Environments," sponsored by ATMI, Private, $123000 Funded. (2010 - 2012).
• Chyan, O. (Principal), "" Electrochemical Investigation of Cu Corrosion in Cu-CMP and Post-CMP Solution Environments "," sponsored by Semiconductor Research Corporation, Private, $100000 Funded. (2007 - 2010).
• Chyan, O. (Principal), Richmond, M. (Co-Principal), ""Study of Organometallic Chemistry and Its Applications to ALD TaN Barrier"," sponsored by Lam Research Inc., Private, $40000 Funded. (2007 - 2008).
• Chyan, O.R. (Other), ""Study of Semiconductor Surface Chemistry and Its Applications to Advanced Interconnects"," sponsored by LAM research, Private, $40000 Funded. (2006 - 2007).
• Chyan, O. (Principal), "Tech Transfer Agreement on US Patent # 9366601: Licensing fee, Service Agreement and Instrumentation Purchase," sponsored by Intel, Private, Funded. (2018 - 2021).
• Chyan, O. (Principal), "Licensed Chyan�s IC packaging technology covered by US Provisional Patent # 62/511,863," sponsored by Changzhou Ruize Microelectronics Co, International, Funded. (2017 - 2018).
• Chyan, O. (Principal), "Characterization of UV-radiated Post-etch Residue MIR-IR Spectroscopy," sponsored by TEL Inc., Private, Funded. (2015 - 2017).
• Chyan, O. (Principal), "Characterization UV treatments for TTCA integrated wafer BEOL polymer removal using MIR-IR Spectroscopy," sponsored by TEL Inc., Private, Funded. (2015 - 2017).
• Chyan, O. (Principal), "Characterization of Plasma Processed Patterned Wafers by MIR-IR Spectroscopy," sponsored by Intel, Private, Funded. (2016 - 2017).
• Chyan, O. (Principal), "Characterization of Plasma Processed Patterned Wafers by MIR-IR Spectroscopy," sponsored by Intel, Private, Funded. (2015 - 2016).
• Chyan, O. (Principal), "Characterization of Plasma Processed Patterned Wafers by MIR-IR Spectroscopy," sponsored by Lam Research Inc., Private, Funded. (2015 - 2016).
• Chyan, O. (Principal), "Characterization of Carbon Nanotubes Coating on Wafers using MIR-IR Spectroscopy," sponsored by Nantero Company, Private, Funded. (2015 - 2016).
• Chyan, O. (Principal), "Characterization of Chemical Equilibriums of Cu Etch Bath Samples," sponsored by Intel, Private, Funded. (2015 - 2016).
• Chyan, O. (Principal), "Investigation of Al Pad Corrosion in the Cu Wire Bonded Semiconductor Device Assembly," sponsored by Semiconductor Research Corporation, Private, Funded. (2014 - 2015).
• Chyan, O. (Principal), "Study of Chemical Bonding Structure of PECVD Amorphous Silicon Micobolometer," sponsored by L3 Communication, Private, Funded. (2014 - 2015).
• Chyan, O. (Principal), "Characterization of Plasma-etched SiC wafers by MIR-IR Spectroscopy," sponsored by Lam Research Inc., Private, Funded. (2012 - 2013).
• Chyan, O. (Principal), "Characterization of Plasma-etched ULK Patterned wafers by MIR-IR Spectroscopy," sponsored by ATMI, Private, Funded. (2012 - 2013).
• Chyan, O. (Principal), "Characterization of ULK Damages wafers by MIR-IR Spectroscopy," sponsored by TEL Inc., Private, Funded. (2012 - 2013).
• Chyan, O. (Principal), "Study of Chemical Bonding Structure of PECVD Amorphous Silicon Micobolometer," sponsored by L3 Communication, Private, Funded. (2012 - 2013).
• Chyan, O. (Principal), "Electrochemical Investigation of Cu Corrosion in Cu-CMP and Post-CMP Solution Environments," sponsored by Semiconductor Research Corporation, Private, Funded. (2010 - 2013).
• Chyan, O. (Principal), "Characterization of Cu/W/Co Bimetallic Corrosion and Inhibition IC Cleaning Solution Environments," sponsored by ATMI, Private, Funded. (2011 - 2012).
• Chyan, O. (Principal), "Characterization of Cu/W/Co Bimetallic Corrosion and Inhibition IC Cleaning Solution Environments," sponsored by ATMI, Private, Funded. (2011 - 2012).
• Chyan, O. (Principal), "Characterization of Plasma-etch-polymers using MIR-IR Spectroscopy," sponsored by Semiconductor Research Corporation, Private, Funded. (2011 - 2012).
• Chyan, O. (Principal), "Interfacial Study of Cu Bimetallic Corrosion and Inhibition IC Cleaning Solution Environments," sponsored by ATMI, Private, Funded. (2010 - 2012).
• Chyan, O. (Principal), "" Electrochemical Investigation of Cu Corrosion in Cu-CMP and Post-CMP Solution Environments "," sponsored by Semiconductor Research Corporation, Private, Funded. (2007 - 2010).
• Chyan, O. (Principal), Richmond, M. (Co-Principal), ""Study of Organometallic Chemistry and Its Applications to ALD TaN Barrier"," sponsored by Lam Research Inc., Private, Funded. (2007 - 2008).
• Chyan, O.M. (Other), ""Study of Semiconductor Surface Chemistry and Its Applications to Advanced Interconnects"," sponsored by LAM research, Private, Funded. (2006 - 2007).

Grant - Research

• Chyan, O.R. (Co-Principal), "Exploring Deep Eutectic Solvents as Environmentally Benign Post-etch Residue Removers," sponsored by Semiconductor Research Cooperation, International, $315000 Funded. (2024 - 2026).
• Yan, H. (Principal), Chyan, O.R. (Co-Principal), "Exploring Deep Eutectic Solvents as Environmentally Benign Post-etch Residue Removers," sponsored by Semiconductor Research Corporation, Private, $315000 Funded. (2024 - 2026).
• Chyan, O.R. (Co-Principal), "Tunable Biobased Molding Compounds and Die-Attach Adhesives," sponsored by Semiconductor Research Corporation, National, $285000 Funded. (2023 - 2024).
• Chyan, O.R. (Principal), "Tunable Low-cost Passivation Coating for Facilitating Copper Wafer-level Bonding," sponsored by Semiconductor Research Corporation, International, $289547 Funded. (2022 - 2024).
• Chyan, O.M. (Principal), "Optimization of Corrosion Prevention Treatments for Cu Wire- Bonded Devices to Achieve High Bonding Reliability," sponsored by NXP Semiconductors, International, $544400 Funded. (2020 - 2024).
• Chyan, O.M. (Principal), "Optimization of Cu-Selective Repassivation Treatments on Cu Redistribution Lines to Achieve Enhanced Reliability," sponsored by Texas Instruments, Local, $88850 Funded. (2019 - 2020).
• Chyan, O. (Principal), "Novel Chemical Approaches to Enhance Etch Anisotropy," sponsored by Intel, Private, $176000 Funded. (2018 - 2019).
• Chyan, O. (Principal), "Protection of Aluminum Oxide and Cobalt Microstructures in Ammonium Fluoride Solution," sponsored by JSR-Micro, Private, $75000 Funded. (2017 - 2018).
• Chyan, O. (Principal), "Characterization of Plasma-etch-polymers using MIR-IR Spectroscopy," sponsored by Intel MSR grant- Semiconductor Research Corporation, Private, $252000 Funded. (2012 - 2014).
• Chyan, O. (Supporting), Littler , C. (Principal), "Characterization of Plasma-etch-polymers using MIR-IR Spectroscopy," sponsored by Army - subcontract, Private, $45000 Funded. (2012 - 2013).
• Chyan, O.R. (Principal), "Optimization of Corrosion Prevention Treatments for Cu Wire Bonded Devices to Achieve High Bonding Reliability," sponsored by NXP Semiconductors, IND, Funded. (2020 - 2022).
• Chyan, O.R. (Principal), "Novel Chemical Approaches to Enhance Etch Anisotropy," sponsored by Semiconductor Research Corporation, NFP, Funded. (2018 - 2019).
• Chyan, O.R. (Principal), "Study of Bimetallic Corrosion at Dissimilar Metal Interfaces," sponsored by Semiconductor Research Corporation, NFP, Funded. (2004 - 2018).
• Chyan, O.R. (Principal), "Protection of Aluminum Oxide and Cobalt Microstructures in Ammonium Fluoride Solution," sponsored by JSR Micro, Inc., IND, Funded. (2017 - 2018).
• Chyan, O.R. (Principal), "Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire Bonded Device Assembly," sponsored by Semiconductor Research Corporation, NFP, Funded. (2016 - 2018).
• Chyan, O. (Principal), "Characterization of Plasma-etch-polymers using MIR-IR Spectroscopy," sponsored by Intel MSR grant- Semiconductor Research Corporation, Private, Funded. (2012 - 2014).
• Chyan, O. (Supporting), Littler, C. (Principal), "Characterization of Plasma-etch-polymers using MIR-IR Spectroscopy," sponsored by Army - subcontract, Private, Funded. (2012 - 2013).

Sponsored Research

• Chyan, O. (Principal), "Hybrid Nanocomposite High-k Dielectric Flexible Films for Semiconductor Applications," sponsored by Norman Hackerman Advanced Research Program (NHARP), State, $48000 Funded. (2010 - 2012).
• Chyan, O.R. (Other), "" Investigation of Cu Electrodeposition and Patination on Metallic Oxide "," sponsored by The Robert A. Welch Foundation, Private, $150000 Funded. (2007 - 2010).
• Chyan, O.R. (Other), ""Corrosion Investigation in a Dynamic Environments for the Next Generation Cu Interconnect Microstructure "," sponsored by Semiconductor Research Corporation, Private, $30000 Funded. (2004 - 2007).
• Chyan, O.R. (Other), "Interfacial Study of Metal Deposition on Metallic Oxide Surfaces "," sponsored by The Robert A. Welch Foundation, Private, $150000 Funded. (2004 - 2007).
• Chyan, O.R. (Other), ""Scanning Probe Microscopic Studies of Metal Depositions on," sponsored by The Robert A.Welch Foundation, Private, $103200 Funded. (1997 - 1998).
• Chyan, O. (Principal), "Hybrid Nanocomposite High-k Dielectric Flexible Films for Semiconductor Applications," sponsored by Norman Hackerman Advanced Research Program (NHARP), State, Funded. (2010 - 2012).
• Chyan, O.M. (Other), "" Investigation of Cu Electrodeposition and Patination on Metallic Oxide "," sponsored by The Robert A. Welch Foundation, Private, Funded. (2007 - 2010).
• Chyan, O.M. (Other), ""Corrosion Investigation in a Dynamic Environments for the Next Generation Cu Interconnect Microstructure "," sponsored by Semiconductor Research Corporation, Private, Funded. (2004 - 2007).
• Chyan, O.M. (Other), "Interfacial Study of Metal Deposition on Metallic Oxide Surfaces "," sponsored by The Robert A. Welch Foundation, Private, Funded. (2004 - 2007).